SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The Hoffman Enclosures Inc. A806NFAL is a wall-mount enclosure constructed from 5052 H-32 aluminum with a smooth brushed finish. It measures 8.00 inches in height, 6.00 inches in width, and approximately 4 inches in depth. The unit features a single door secured by stainless steel screws and clamps on all four sides. It provides environmental protection rated for NEMA 3R, 4, 4X, 12, 13, and IP66 standards. Weldnuts are included to facilitate the mounting of optional panels.
Verify that the specific order matches the A806NFAL part number to ensure the correct aluminum construction and clamp-style closure mechanism. Confirm that the required ingress protection rating aligns with the specified NEMA 3R/4/4X/12/13/IP66 classification for the intended installation environment. Ensure compatibility with any optional panels by checking the availability of the provided weldnut mounting points.
Select this model when a non-corrosive, lightweight enclosure is required for wall mounting. The aluminum composition offers better weight characteristics compared to steel alternatives while maintaining necessary environmental seals. Verify that the internal dimensions accommodate the specific components, as the depth is approximately 4 inches. Consider the clamp closure system if frequent access is needed without removing fasteners entirely.
This component belongs to the Hoffman NFAL series of wall-mount enclosures designed for general industrial use. The series typically includes various sizes made from aluminum to provide cost-effective protection against dust, water, and corrosion. The A806NFAL represents a compact configuration within this lineup, suitable for smaller control assemblies or junction box applications where space is limited but durability is required.
Public confirmed substitute part numbers: None identified.

Learn how rectifiers convert AC to DC, compare half-wave and bridge circuits, and select voltage, current, recovery and thermal ratings for your design.
Read More
Learn what a battery BMS does, how protection differs from charging, and which pack specifications to check when sourcing BMS components through ChipApex.
Read More
In embedded design, the tug-of-war between cost and performance is constant. On one side, you have Microcontrollers (MCUs)—cheap, simple, and efficient. On the other,…
Read MoreAs 2025 draws to a close, the global semiconductor industry stands at a crossroads. Intertwined with escalating geopolitical tensions, supply chain disruptions, and groundbreaking…
Read More
Geneva, Switzerland – March 25, 2026 – STMicroelectronics N.V. (NYSE: STM), a global semiconductor leader serving customers across the electronics applications spectrum, has announced…
Read More
On September 22nd, it was reported that Samsung Electronics, the South Korean tech giant, had successfully passed NVIDIA’s certification test for its 12-layer HBM3E…
Read MoreON Semiconductor (onsemi), a global leader in intelligent power and sensing technologies, has announced plans to implement price adjustments for select product lines, effective…
Read More
TOKYO — Global leading semiconductor and power electronic components manufacturer Renesas Electronics officially issued a new price adjustment notice in early September 2026, confirming…
Read More
PLANO, Texas – March 20, 2026 – Diodes Incorporated (Nasdaq: DIOD), a leading global manufacturer and supplier of high-quality application-specific standard products in the…
Read MoreLatest updates from leading semiconductor manufacturers: Wolfspeed launches new SiC modules, AMD reveals MI430X with HBM4, TSMC eyes third Japan fab, and Samsung samples…
Read More
Compare thermistors, RTDs, thermocouples and temperature ICs. Learn how range, accuracy, response, interfaces and mounting affect component selection.
Read More
On October 1, 2025 local time, OpenAI, an artificial intelligence research company, announced the establishment of a cooperative relationship with Samsung Electronics and SK…
Read More