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AD9225ARSRL is listed in the Analog To Digital Converters (ADC) range at ChipApex. The manufacturer field lists Analog Devices Inc.. Its product description is IC ADC 12BIT PIPELINED 28SSOP. Review the specifications below when checking this part for your BOM.
The AD9225ARSRL is a monolithic, single-supply, 12-bit analog-to-digital converter featuring a 25 MSPS sampling rate. It utilizes a multistage differential pipelined architecture with output error correction logic to guarantee no missing codes across the full operating temperature range. The device integrates a high-performance sample-and-hold amplifier and an on-chip voltage reference. It operates on a single 5 V analog supply (AVDD) and supports digital driver supplies from 2.85 V to 5.25 V (DRVDD). Key performance metrics include a Signal-to-Noise Ratio of 71 dB and a Spurious-Free Dynamic Range of –85 dB. The component is housed in a 28-lead SSOP package.
Verify the specific ordering suffix 'RL' corresponds to the reel packaging configuration required for automated assembly processes. Confirm that the pinout matches the 28-lead SSOP footprint specified in the datasheet. Ensure that the design accounts for the separate AVDD and DRVDD power domains to maintain signal integrity and proper logic level translation.
Select this component when a single-supply solution is required for 12-bit resolution at 25 MSPS. Consider the internal reference options if system drift requirements are met by the on-board band gap reference. Evaluate the input impedance characteristics of the driving source against the dynamic SHA requirements to optimize SNR and THD performance.
The AD9225 belongs to a family of monolithic ADCs fabricated on a low-cost CMOS process. It shares pin compatibility with the AD9220, AD9221, AD9223, and AD9224 models. This integration allows designers to replace higher-power bipolar implementations while maintaining comparable resolution and speed specifications.
The AD9225ARZ is a pin-compatible alternative available in a 28-lead SOIC package. Designers must verify that the physical footprint and thermal characteristics of the SOIC package align with the PCB layout constraints before substituting the SSOP variant.
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