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ADC1061CIWM is listed in the Analog To Digital Converters (ADC) range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC ADC 10BIT FLASH 20SOIC. Review the specifications below when checking this part for your BOM.
The ADC1061CIWM is a 10-bit high-speed analog-to-digital converter manufactured by Texas Instruments (originally National Semiconductor). It utilizes a modified half-flash conversion technique to achieve fast conversion times while maintaining low power dissipation of up to 235 mW. The device features an internal track-and-hold circuit, eliminating the need for external sampling components. It operates on a single +5V supply and provides a parallel TRI-STATE digital interface compatible with microprocessors. The component is housed in a 20-pin Small Outline package (M20B) and supports an industrial operating temperature range of -40°C to +85°C.
Verify component authenticity as this part originates from National Semiconductor prior to its acquisition by Texas Instruments. Confirm the specific suffix 'CIWM' corresponds to the industrial temperature grade (-40°C to +85°C) and the M20B small outline package. Check current availability status as legacy components may be subject to discontinuation or limited stock constraints.
Select the ADC1061CIWM when a 10-bit resolution and conversion speeds under 2 ms are required for single-supply applications. Ensure the analog source impedance is below 500 Ohms to maintain accuracy at the minimum sample time. Verify that the system can accommodate the parallel data bus and control signals (CS, S/H, RD) for proper interface timing.
This component belongs to the ADC1061 family of high-speed A/D converters. The 'C' designation indicates the industrial temperature range variant, while 'WM' specifies the surface-mount small outline package. Other variants include the ceramic J package (ADC1061CIJ) and the plastic DIP N package (ADC1061CIN).
Direct pin-compatible replacements within the same family include ADC1061CIJ and ADC1061CIN, differing primarily in package type and thermal characteristics. Cross-family replacements require verification of interface compatibility and performance specifications.
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