Soc System On Chip AGFA019R31C2I1V product image

AGFA019R31C2I1V

$24,780.13
  • Description:IC FPGA AGILEX-F 3184FBGA
  • Series:Agilex F

SKU:8dea8776c22c Category: Brand:

  
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AGFA019R31C2I1V is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists Altera. Its product description is IC FPGA AGILEX-F 3184FBGA. Review the specifications below when checking this part for your BOM.

Soc System On Chip specifications for AGFA019R31C2I1V

  • Description:IC FPGA AGILEX-F 3184FBGA
  • Series:Agilex F
  • Mfr:Altera
  • Package:Tray
  • Architecture:MPU, FPGA
  • Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:1.4GHz
  • Primary Attributes:FPGA - 1.9M Logic Elements
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Package / Case:3184-BFBGA Exposed Pad
  • Supplier Device Package:3184-BGA (56x45)

Soc System On Chip datasheet and documents for AGFA019R31C2I1V

AGFA019R31C2I1V

Soc System On Chip Overview

The AGFA019R31C2I1V is an Agilex F-series System on Chip integrating a 1.9M logic element FPGA with a quad-core ARM Cortex-A53 processor running at 1.4GHz. It features 256KB RAM, 480 I/Os, and supports EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG interfaces. The device operates within a junction temperature range of -40°C to 100°C and utilizes a 3184-BGA package measuring 56x45 mm.

Soc System On Chip Feature Summary

  • Integrates 1.9 million logic elements with embedded ARM Cortex-A53 processing cores
  • Supports high-speed connectivity including Ethernet and USB OTG
  • Includes CoreSight debug infrastructure for the processor subsystem

Soc System On Chip Applications

  • High-performance embedded computing systems requiring mixed programmable logic and processing
  • Industrial automation controllers utilizing real-time processing capabilities
  • Communication infrastructure equipment supporting multiple serial and parallel interfaces
  • Automotive infotainment or instrument cluster designs meeting extended temperature requirements

Soc System On Chip Procurement Notes

Verify the specific suffix codes against official Altera documentation to confirm operating temperature grade and package variant accuracy. Confirm moisture sensitivity level handling requirements prior to assembly. Ensure design tools are compatible with the Agilex F-series architecture. Check for any recent product change notices regarding labeling or marking updates that may affect identification.

Soc System On Chip Selection Notes

Select this component when both substantial FPGA fabric capacity and embedded application processing are required in a single die. Compare against other Agilex F variants based on specific logic density needs and interface availability. Consider the 3184-ball BGA footprint constraints during PCB layout planning. Evaluate thermal management solutions suitable for the specified junction temperature range.

Soc System On Chip Part Context

This part belongs to the Agilex 7 F-Series family, designed for applications demanding high performance and low power consumption. The series combines Intel's FPGA technology with embedded processors, enabling flexible system architectures. It targets markets requiring robust data processing and rapid prototyping capabilities within a unified hardware platform.

AGFA019R31C2I1VAGFA019R31C2I1V
$24,780.13
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