Memory IC AS4C256M8D3A-12BIN product image

AS4C256M8D3A-12BIN

  • Description:IC DRAM 2GBIT PARALLEL 78FBGA
  • Series:-
  • Mfr:Alliance Memory, Inc.
  • Package:Tray

SKU:946d0e0dcfda Category: Brand:

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AS4C256M8D3A-12BIN is listed in the Memory IC range at ChipApex. The manufacturer field lists Alliance Memory, Inc.. Its product description is IC DRAM 2GBIT PARALLEL 78FBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for AS4C256M8D3A-12BIN

  • Description:IC DRAM 2GBIT PARALLEL 78FBGA
  • Series:-
  • Mfr:Alliance Memory, Inc.
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:SDRAM - DDR3
  • Memory Size:2Gbit
  • Memory Organization:256M x 8
  • Memory Interface:Parallel
  • Clock Frequency:800 MHz
  • Write Cycle Time - Word, Page:15ns
  • Voltage - Supply:1.425V ~ 1.575V
  • Operating Temperature:-40°C ~ 95°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:78-VFBGA
  • Supplier Device Package:78-FBGA (8x10.5)
  • Access Time:20 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for AS4C256M8D3A-12BIN

AS4C256M8D3A-12BIN

Memory IC Overview

The AS4C256M8D3A-12BIN is a 4 Gbit DDR3 SDRAM manufactured by Alliance Memory. It features an organization of 32 M x 8 and supports data rates up to 800 MHz. The device operates within a voltage range of 1.425 V to 1.575 V and utilizes a 96-ball FBGA package. Designed for industrial applications, it functions reliably between -40°C and +95°C.

Memory IC Feature Summary

  • Supports high-speed synchronous data transfer via DDR3 architecture
  • Includes auto-refresh and self-refresh modes for power management
  • Compatible with standard JEDEC clock jitter specifications

Memory IC Applications

  • Industrial control systems requiring robust memory performance
  • Medical equipment needing stable data storage
  • Consumer electronics utilizing DDR3 interfaces

Memory IC Procurement Notes

Verify component authenticity through authorized distributors. Confirm RoHS compliance status prior to integration. Check for moisture sensitivity handling requirements during storage. Ensure supply chain stability due to potential lifecycle changes.

Memory IC Selection Notes

Select this part for designs requiring 4 Gbit density with 8-bit width. Verify voltage compatibility with 1.5V systems. Consider thermal constraints for industrial temperature ranges. Evaluate package footprint against PCB layout limitations.

Memory IC Part Context

This component belongs to the AS4C256M16D3A series family, offering various density and width configurations. It represents Alliance Memory's commitment to providing reliable DRAM solutions for diverse computing environments.

Memory IC Replacement Considerations

Check for pin-compatible alternatives from ISSI or Micron Technology. Verify electrical parameter matching before substitution.

AS4C256M8D3A-12BINAS4C256M8D3A-12BIN

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