SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The Hoffman Enclosures ASE12X10X4SSNK is a wall-mounted pull box constructed from 304 stainless steel with a No. 2B finish. It features a screw-cover design and meets NEMA Type 3R, 4X, and IP66 ratings. The enclosure dimensions are 12 inches in height, 10 inches in width, and 4 inches in depth. The body is fabricated from 14-gauge material, while the door utilizes 12-gauge stock. It includes no knockouts and is designed for single-door access.
Verify the specific gauge requirements for both the body (14 ga) and door (12 ga) against project specifications. Confirm that the absence of knockouts aligns with cable entry needs. Ensure the NEMA 4X and IP66 ratings satisfy environmental exposure conditions. Check compatibility with existing mounting hardware for wall installation.
Select this model when a compact, corrosion-resistant pull box is required for wall mounting. The 12x10x4 inch size suits tight spaces where larger enclosures are impractical. The screw-cover mechanism offers a cost-effective alternative to hinged doors while maintaining ingress protection. Suitable for applications demanding stainless steel durability without complex access mechanisms.
This component belongs to the Hoffman Screw-Cover Type 4X series, specifically designed as a metallic wall-mounted enclosure. It is part of the broader nVent Hoffman product line focused on protective housing solutions. The series emphasizes durability and environmental sealing for electrical infrastructure.
No public confirmed substitute part numbers are available in the provided documentation.

Learn how a JFET works and how to compare bias, leakage, noise and pinout. Review practical selection questions for high-impedance analog circuits.
Read More
Understand UART protocol framing, baud rate and electrical interfaces. Learn 8N1 timing, TX/RX wiring, buffering and practical troubleshooting steps.
Read More
Choose a rocker switch by AC/DC ratings, contact arrangement, illumination, panel fit and sealing. Get practical checks for engineering and component sourcing.
Read MoreLas Vegas, January 6, 2026 — At the Consumer Electronics Show (CES) 2026, Texas Instruments (TI) (NASDAQ: TXN) announced a suite of next-generation semiconductor…
Read More
Samsung Electronics, the world’s largest memory chip manufacturer, has officially confirmed the end-of-life (EOL) for its LPDDR4 and LPDDR4X low-power DRAM products, marking a…
Read More
Choose logic inverter ICs by thresholds, supply, output drive and delay. Compare standard and Schmitt-trigger inputs, power sequencing and replacement checks.
Read More
Manchester, New Hampshire, USA – March 22, 2026 – Allegro MicroSystems, Inc. (Nasdaq: ALGM), a global leader in high-performance power and sensing semiconductor solutions…
Read More
The global memory market is entering an unprecedented supply-constrained phase as soaring demand from artificial intelligence (AI) infrastructure collides with strategic capacity reallocations by…
Read More
On October 1, 2025 local time, OpenAI, an artificial intelligence research company, announced the establishment of a cooperative relationship with Samsung Electronics and SK…
Read More
Munich, Germany – February 8, 2026 — Infineon Technologies, the German semiconductor giant, officially issued a price increase notice on February 5, announcing that…
Read More
ChipApex – May 8, 2026 Texas Instruments (TI), the global leader in analog and embedded semiconductors, has officially notified customers of an upcoming company-wide…
Read MoreLatest updates from leading semiconductor manufacturers: Wolfspeed launches new SiC modules, AMD reveals MI430X with HBM4, TSMC eyes third Japan fab, and Samsung samples…
Read More