AT-2333-764

AT-2333-764

  • Description:AT-2333-764
  • Series:*
  • Mfr:Samtec Inc.
  • Package:Bulk

SKU:acffa077c56b Category: Brand:

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Product Detailed Parameters

  • Description:AT-2333-764
  • Series:*
  • Mfr:Samtec Inc.
  • Package:Bulk

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AT-2333-764

Overview

The AT-2333-764 is a flexible board stacking header manufactured by Samtec Inc. It features a 2.00 mm pitch and is designed for surface mount applications. The component complies with EU RoHS, REACH, and China RoHS standards. It is halogen-free according to JS-709C and has a Moisture Sensitivity Level of 1. The product carries an HTS code of 8536.69 and an ECCN code of EAR99.

Feature Summary

  • Flexible board stacking design for reliable interconnection
  • Surface mount termination style
  • Halogen-free construction compliant with JS-709C

Applications

  • Board-to-board stacking connections
  • High-density electronic assemblies
  • Surface mount circuit integration

Procurement Notes

Verify the exact configuration against the official Series Print before finalizing the design. Confirm that the selected variant matches the required pin count and tail length specifications. Ensure compliance requirements such as RoHS and REACH align with project regulations. Cross-reference the datasheet parameters to validate electrical and mechanical suitability for the target application environment.

Selection Notes

Evaluate the specific pin configuration and tail length options available within the AT series to match the stack height requirements. Consider the surface mount footprint compatibility with the PCB layout. Verify signal integrity needs and ensure the connector type supports the intended current and voltage levels. Review the 3D models for accurate spatial clearance assessment during assembly planning.

Part Context

This component belongs to Samtec's Flexible Board Stacking Header family, characterized by a 2.00 mm pitch. These headers are engineered for high-density interconnects in compact electronic designs. The series offers various configurations to accommodate different board stacking heights and connection densities while maintaining reliable electrical performance in surface mount processes.

AT-2333-764AT-2333-764

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