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AT97SC3205T-X3A13-10 is listed in the Application Specific Microcontrollers range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is TPM I2C C8 REVF COMM 4.4MM TSSOP. Review the specifications below when checking this part for your BOM.
The AT97SC3205T-X3A13-10 is a Trusted Platform Module (TPM) compliant with the TCG TPM Version 1.2 specification. It integrates an Atmel AVR RISC microprocessor, hardware asymmetric crypto engine, and internal EEPROM for RSA key storage. The device supports I2C communication at 400kHz Fast Mode or 100kHz Standard Mode. It operates on a 3.3V supply voltage and includes a FIPS-140-2 certified high-quality Random Number Generator (RNG). The component provides 2066 bytes of NV storage for user-defined data and is available in 28-lead Thin TSSOP or 32-pad QFN packages.
Verify the specific ordering suffix against the manufacturer's current catalog to confirm package type and temperature range. Confirm availability status as product lifecycles may change. Ensure compatibility with the host system's I2C pull-up requirements, specifically noting recommended values for stable operation at 400kHz.
Select the appropriate package variant based on board space constraints; the 28-lead Thin TSSOP offers a 4.4mm body width, while the 32-pad QFN provides a compact 4.0mm x 4.0mm footprint. Verify operational temperature requirements, as the device is offered in Commercial (0°C to 70°C) and Industrial (-40°C to 85°C) ranges. Ensure the design accommodates the required decoupling capacitors near VCC pins for reliable noise immunity.
The AT97SC3205T series represents a fully integrated security module designed for embedded integration. Originally developed by Atmel Corporation, which was acquired by Microchip Technology, this component implements the TPM 1.2 standard. It serves as a single-chip turnkey solution for securing hardware and firmware through dedicated cryptographic engines and secure storage.
Consult the AT97SC3205T Summary Part Number Selection Guide for alternative variants within the same family that may differ in package style or temperature rating. No direct cross-manufacturer substitutes are documented in the provided source material.
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