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AUIRFSA8409-7P is listed in the Single FETs, MOSFETs range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is MOSFET N-CH 40V 523A D2PAK. Review the specifications below when checking this part for your BOM.
The AUIRFSA8409-7P is an N-channel enhancement mode HEXFET power MOSFET in a D2PAK-7TP package. It features a maximum drain-source voltage of 40 V and a typical on-resistance of 0.50 mΩ, with a maximum rating of 0.69 mΩ at VGS = 10V and ID = 100A. The device supports a continuous silicon-limited drain current of 523 A at TC = 25°C, while the package-limited current is 360 A. Maximum power dissipation reaches 375 W at TC = 25°C. Operating junction temperature ranges from -55 °C to +175 °C.
Verify component authenticity through authorized Infineon channels or certified distributors. Confirm that the part matches the specific automotive qualification requirements for your application. Ensure proper handling procedures are followed due to ESD sensitivity ratings. Review the datasheet for absolute maximum ratings before integration into final designs.
Select this component when low conduction losses and high current capacity are required in automotive environments. Consider the thermal resistance characteristics and package limitations for heat dissipation. Evaluate gate charge parameters against driver capabilities to optimize switching performance. Ensure the operating voltage and current levels remain within specified safe operating area limits.
This device belongs to Infineon's COOLiRFET series, designed specifically for demanding automotive applications. It utilizes advanced processing techniques to achieve extremely low on-resistance per silicon area. The HEXFET architecture provides robust performance under high stress conditions, making it suitable for power management tasks in vehicles.
Check pinout compatibility and electrical specifications before substituting. Verify that any alternative component meets the same automotive qualification standards. Ensure thermal performance and package dimensions align with existing board layouts.
Silicon-limited current (523 A) represents the theoretical maximum based on junction temperature constraints, while package-limited current (360 A) reflects the physical limit imposed by bond wires and lead heating.
Yes, the device allows repetitive avalanche operation up to the maximum junction temperature (Tjmax), provided the single pulse avalanche energy limits are not exceeded.
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