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BD6226FP-E2 is listed in the Full Half-Bridge (H Bridge) Drivers range at ChipApex. The manufacturer field lists Rohm Semiconductor. Its product description is IC HALF BRIDGE DRIVER 1A 25HSOP. Review the specifications below when checking this part for your BOM.
The BD6226FP-E2 is a two-channel half-bridge motor driver manufactured by ROHM Semiconductor. It operates within a supply voltage range of 6 V to 15 V and delivers an output current of 1 A per channel. The device features a low operating power consumption of 2 mA and supports a maximum power dissipation of 1.4 W. It is designed for surface mount installation in an HSOP-25 package, with a specified operating temperature range from -40 °C to +85 °C.
Verify the specific suffix E2 against the manufacturer's latest datasheet to confirm compliance with RoHS directives and REACH standards. Ensure the HSOP-25 package dimensions match the target PCB footprint. Confirm that the 1 A continuous current rating aligns with the peak load requirements of the intended motor application without exceeding the 1.4 W power dissipation limit under worst-case thermal conditions.
Select this component when dual-channel control is required within a 15 V system limit. The 1 A output capacity suits small to medium-sized brushed DC motors. Consider the HSOP-25 package size relative to available board space. Evaluate thermal management needs given the 1.4 W dissipation capability, as higher ambient temperatures may require additional heat sinking to maintain operation within the +85 °C junction limit.
This part belongs to the BD6226FP series of motor drivers from ROHM. It is categorized under PMIC and specifically Brushed DC Motor Drivers. The series is designed for general-purpose motion control applications requiring reliable half-bridge driving capabilities with integrated safety features.
Check for pin-compatible alternatives within the same ROHM family if lead times are critical. Verify that any substitute maintains the 15 V maximum voltage rating and 1 A current capacity. Ensure the replacement package matches the HSOP-25 form factor for direct board integration.
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