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BDQQ00201210R47MPA is listed in the Fixed Inductors range at ChipApex. The manufacturer field lists Pulse Electronics. Its product description is INDUCTOR MOLDED 0.47UH 5.3A. Review the specifications below when checking this part for your BOM.
The BDQQ00201210R47MPA is a surface-mount power inductor from Pulse Electronics, featuring a fixed inductance of 470 nH with a ±20% tolerance. It operates with an RMS current rating of 4.5 A and a saturation current of 5 A. The component exhibits a maximum DC resistance of 20 mΩ and utilizes a metal powder core material. Designed for high-density applications, it employs a shielded molded construction to minimize electromagnetic interference and acoustic noise. The device is housed in a standard 0805 (2012 Metric) package, suitable for automated surface-mount assembly processes.
Verify the specific ordering suffix and manufacturer part number against official Pulse Electronics documentation before procurement. Confirm that the requested component matches the exact electrical specifications and physical dimensions required for the target application. Ensure compliance with relevant environmental standards and check for any specific handling or storage requirements outlined in the manufacturer's datasheet to maintain component integrity during installation.
Select this component when space constraints require a compact 0805 footprint combined with shielding capabilities. The choice is appropriate for designs prioritizing low acoustic noise and high current handling within a small volume. Engineers should evaluate the thermal performance and impedance characteristics against the system's operational frequency and load requirements to ensure optimal efficiency and signal integrity in the final assembly.
This component belongs to the Pulse Electronics power inductor portfolio, specifically designed for surface-mount technology. It represents a solution for modern electronics where miniaturization and electromagnetic compatibility are critical. The series integrates magnetic shielding directly into the molded structure, distinguishing it from unshielded alternatives while maintaining a standardized mechanical outline for broad compatibility across various consumer and industrial devices.
Consult official substitution lists for confirmed equivalent part numbers. Verify that any alternative maintains identical inductance, current ratings, and physical dimensions to ensure seamless integration without redesigning the printed circuit board layout.
The component utilizes a metal powder core material.
Yes, it employs a molded magnetic shielded type construction.
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