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BGS13S2N9E6327XTSA1 is listed in the RF Switches range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is IC RF SWITCH SP3T 3GHZ TSNP9-3. Review the specifications below when checking this part for your BOM.
The BGS13S2N9E6327XTSA1 is an RF switch IC manufactured by Infineon Technologies, designed for wireless communication systems. It features a Single-Pole Triple-Throw (SP3T) configuration with GPIO control interface. The device operates within a frequency range of 100 MHz to 3 GHz and supports a maximum power handling of 32 dBm. Key electrical parameters include an insertion loss of 0.21 dB at 1 GHz and typical isolation of 18 dB. It functions on a supply voltage of 1.65 V to 3.4 V and is housed in a TSNP-9-3 surface-mount package.
Verify the specific suffix E6327XTSA1 against official Infineon documentation to confirm tape-and-reel packaging specifications and moisture sensitivity level. Ensure the ordering part number matches the exact pinout and thermal characteristics required for your PCB layout. Cross-reference the datasheet revision date to confirm compliance with current RoHS standards before finalizing procurement orders.
Select this component when a compact SP3T solution is required for frequencies up to 3 GHz. It is suitable for designs prioritizing low insertion loss and moderate isolation levels. Consider the TSNP-9-3 package dimensions during layout planning. This part is appropriate for battery-powered devices due to its low operating voltage range and GPIO-driven control mechanism.
This component belongs to Infineon's BGS series of RF switches, which are optimized for mobile handsets and portable wireless devices. These integrated circuits replace discrete switch networks, reducing board space and improving performance consistency. The BGS13S2N9 variant specifically targets mid-frequency bands common in cellular and IoT communications.
Public confirmed substitute part numbers: None identified.
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