BL LP 2 38 Z

Headers, Receptacles, Female Sockets Overview

The BL LP 2 38 Z is a precision board-to-board connector manufactured by Fischer Elektronik. It features a dual-row configuration with 38 contacts, designed for surface mount technology (SMD) applications. The component utilizes copper alloy contacts with tin plating to ensure reliable electrical connections in compact electronic assemblies.

Headers, Receptacles, Female Sockets Feature Summary

• Dual-row design for high-density interconnects
• Surface mount construction for automated assembly
• Tin-plated copper alloy contacts for conductivity

Headers, Receptacles, Female Sockets Applications

• Compact electronic device interconnects
• High-density circuit board stacking
• Precision instrumentation modules

Headers, Receptacles, Female Sockets Procurement Notes

Verify the specific contact count and plating specifications against the official Fischer Elektronik datasheet before procurement. Ensure compatibility with SMD reflow processes and confirm that the tin-plated finish meets the required environmental standards for the intended application environment.

Headers, Receptacles, Female Sockets Selection Notes

Select this component when a low-profile, dual-row SMD connector is required for dense board-to-board connections. Consider the tin-plated contact material for general-purpose use where gold plating is not strictly necessary. Verify mechanical fit within the available vertical space constraints of the assembly.

Headers, Receptacles, Female Sockets Part Context

This part belongs to the BL LP series from Fischer Elektronik, which specializes in precision connectors for demanding industrial and consumer electronics. The series offers various configurations tailored for different mounting styles and contact densities, supporting modern miniaturization trends in electronic hardware design.

Headers, Receptacles, Female Sockets Replacement Considerations

Consult the official Fischer Elektronik documentation for direct cross-reference part numbers. Generic equivalents may lack the precise dimensional tolerances and contact material specifications required for reliable performance in high-density applications.