BLM LG 1 26 Z

Headers, Receptacles, Female Sockets Overview

The BLM LG 1 26 Z is a 26-position header connector manufactured by Fischer Elektronik. It features a single row of contacts with a 0.050-inch (1.27mm) pitch. The component utilizes through-hole technology for PCB mounting and employs tin plating on the contacts to ensure reliable electrical connections.

Headers, Receptacles, Female Sockets Feature Summary

• Single-row socket strip configuration
• Through-hole termination method
• Tin-plated contact surfaces

Headers, Receptacles, Female Sockets Applications

• General electronic circuit board interconnections
• Signal routing in consumer electronics
• Industrial control panel wiring

Headers, Receptacles, Female Sockets Procurement Notes

Verify the specific ordering suffix 'Z' against the manufacturer's current datasheet to confirm plating type and availability. Ensure the pin count matches the required 26 positions for the target application. Cross-reference the package dimensions with the PCB footprint design to guarantee mechanical compatibility during assembly.

Headers, Receptacles, Female Sockets Selection Notes

Select this component when a low-profile, single-row connection is required for dense PCB layouts. The 1.27mm pitch offers a balance between signal density and manufacturing ease. Consider the through-hole mounting style if mechanical strength and durability are prioritized over surface-mount space constraints.

Headers, Receptacles, Female Sockets Part Context

This part belongs to the BLM LG series of header connectors from Fischer Elektronik. The series provides various position counts and configurations for standard electronic assemblies. These connectors are designed for general-purpose applications requiring robust through-hole connectivity.

Headers, Receptacles, Female Sockets Replacement Considerations

Direct substitutes must match the 26-position count, 1.27mm pitch, and through-hole format. Verify that alternative manufacturers offer compatible tin-plated contacts and identical housing height specifications to ensure seamless integration without PCB redesign.