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BTA316B-600C,118 is listed in the Triacs range at ChipApex. The manufacturer field lists WeEn Semiconductors. Its product description is TRIAC 600V 16A D2PAK. Review the specifications below when checking this part for your BOM.
The BTA316B-600C,118 is a planar passivated high commutation three-quadrant triac manufactured by WeEn Semiconductors. It is housed in a TO263 (D2PAK) plastic package designed for circuits experiencing high static and dynamic dV/dt and dI/dt conditions. The device supports an RMS current of 16 A with a peak non-repetitive on-state current of 140 A. It features a rated repetitive off-state voltage of 600 V and a maximum junction temperature of 125°C. The component operates without the need for a snubber circuit to commutate full rated RMS current at maximum junction temperature.
Verify the specific orderable part number BTA316B-600C,118 against the manufacturer's official documentation to ensure compatibility with the intended PCB footprint and thermal management requirements. Confirm RoHS compliance status and lead-free plating specifications directly from the supplier's latest product change notifications or datasheets prior to finalizing procurement decisions.
Select this component when a through-hole equivalent is replaced by a surface-mount solution requiring high commutation performance. Ensure the application circuit can handle the 600 V blocking voltage and that the thermal design accommodates the 125°C maximum junction temperature limit inherent to the TO263 package configuration.
This part belongs to the BTA316 series of three-quadrant triacs produced by WeEn Semiconductors. The 'Series C' designation indicates specific gate trigger characteristics and commutation capabilities distinct from other series variants within the same family. It serves as a robust alternative for high-power AC switching applications requiring compact surface-mount packaging.
Direct replacements include BTA316B-600C,118 from NXP Semiconductors, which shares identical electrical parameters and pinout configuration. Verify package dimensions and thermal pad specifications to ensure mechanical compatibility during substitution.
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