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BZX584C2V4-AU_R1_000A1 is listed in the Single Zener Diodes range at ChipApex. The manufacturer field lists Panjit International Inc.. Its product description is DIODE ZENER 2.4V 200MW SOD523. Review the specifications below when checking this part for your BOM.
The BZX584C2V4-AU_R1_000A1 is a surface mount silicon Zener diode from the BZX584C series manufactured by Panjit International Inc. It features a planar die construction and operates within a temperature range of -55°C to +150°C. The device provides a nominal Zener voltage of 2.4 V with a tolerance of ±5%, tested at a current of 5.0 mA. Maximum power dissipation is rated at 200 mW, supported by a maximum Zener impedance of 100 Ω at the test current and 600 Ω at a knee current of 1.0 mA. Reverse leakage current is limited to 50 µA when measured at 1.0 V.
Verify component authenticity by cross-referencing the manufacturer part number and lot code against official Panjit documentation. Confirm that the delivered units match the specified SOD-523 package dimensions and marking codes. Ensure storage conditions adhere to moisture sensitivity level requirements prior to soldering.
Select this component when a precise 2.4 V reference is required in space-constrained designs utilizing the SOD-523 footprint. Consider the 200 mW power rating and thermal derating characteristics for high-temperature environments. Verify that the 50 µA reverse leakage specification meets the circuit's isolation requirements.
This component belongs to the BZX584C-AU series of surface mount Zener diodes offered by Panjit. The series covers a wide voltage range from 2.4 V to 75 V, all sharing the same compact SOD-523 plastic case and 200 mW power dissipation capability. The AU suffix indicates specific packaging and compliance attributes consistent with the manufacturer's standard product line.
Direct substitutes include other manufacturers' Zener diodes with identical 2.4 V nominal voltage, 200 mW power rating, and SOD-523 package outline. Ensure replacement parts meet AEC-Q101 qualification if automotive application reliability is required.
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