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Product Detailed Parameters
- Description:IC OPAMP TRANSCOND 1 CIRC 8DIP
- Series:-
- Mfr:Rochester Electronics, LLC
- Package:Bulk
- Amplifier Type:Transconductance
- Number of Circuits:1
- Output Type:Push-Pull
- Slew Rate:75V/µs
- Gain Bandwidth Product:2 MHz
- Current - Input Bias:2 µA
- Voltage - Input Offset:400 µV
- Current - Supply:1mA
- Current - Output / Channel:650 µA
- Voltage - Supply Span (Min):4 V
- Voltage - Supply Span (Max):30 V
- Operating Temperature:-55°C ~ 125°C
- Grade:-
- Qualification:-
- Mounting Type:Through Hole
- Package / Case:8-DIP (0.300", 7.62mm)
- Supplier Device Package:8-PDIP
- -3db Bandwidth:-
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Overview
The CA3080AE-G is a transconductance operational amplifier manufactured by Rochester Electronics, LLC. It features a bipolar architecture housed in an 8-pin PDIP package. Key electrical specifications include a maximum input offset voltage of 5000 µV and a bandwidth of 2 MHz. The device exhibits a typical common-mode rejection ratio of 110 dB with a minimum of 80 dB. Bias current characteristics vary from 5 µA at 25°C to 15 µA maximum average.
Feature Summary
- Transconductance operational amplifier architecture
- Internal frequency compensation for stability
- High common-mode rejection capability
- Bipolar process technology
Applications
- General-purpose analog signal processing circuits
- Audio pre-amplification stages
- Sensor signal conditioning interfaces
- Active filter implementations
- Voltage follower configurations
Procurement Notes
Verify the specific suffix designation against the manufacturer's official documentation to confirm exact binning or testing criteria. Ensure the component source matches the required quality level for the intended application environment.
Selection Notes
Select this component when a robust bipolar transconductance amplifier is required. Consider the 5000 µV offset limit and 2 MHz bandwidth against circuit requirements. Evaluate the PDIP8 package constraints for thermal and spatial limitations.
Part Context
Rochester Electronics specializes in sourcing and distributing obsolete and hard-to-find semiconductor components. This part represents a continuation of legacy designs originally developed by Harris or Intersil, now managed under the Renesas portfolio structure.
Replacement Considerations
Official substitute part numbers are not explicitly confirmed in the provided source material. Consult the manufacturer's datasheet for direct pin-compatible alternatives within the same family.
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