CDZVT2R3.0B

Single Zener Diodes Overview

The CDZVT2R3.0B is a single Zener diode manufactured by ROHM Semiconductor, designed for surface-mount applications in the SOD-923-2 package. It features a nominal Zener voltage of 3.0 V with a maximum reverse leakage current of 1 µA and a power dissipation rating of 100 mW. The device operates within a temperature range of -55 °C to +150 °C and exhibits a Zener impedance of 40 Ohms at a test current of 40 mA.

Single Zener Diodes Feature Summary

• Compact SOD-923-2 surface-mount package suitable for space-constrained designs
• High thermal stability with an operating junction temperature up to 150 °C
• Low leakage current characteristics for efficient voltage regulation

Single Zener Diodes Applications

• Constant voltage control circuits
• Voltage reference generation
• Transient voltage suppression in low-power systems

Single Zener Diodes Procurement Notes

Verify the specific suffix against official ROHM documentation to confirm exact electrical tolerances and packaging configurations. Ensure the selected variant matches the required Zener voltage precision and thermal ratings for the target application environment before finalizing procurement orders.

Single Zener Diodes Selection Notes

Select this component when a compact footprint and high-temperature operation are required. Compare the 100 mW power dissipation limit against circuit load requirements. Verify that the SOD-923-2 package dimensions align with the PCB layout constraints and soldering profile specifications.

Single Zener Diodes Part Context

This part belongs to the CDZVT series of Zener diodes from ROHM Semiconductor. These components are engineered for general-purpose voltage regulation tasks where small form factors are critical. The series offers various voltage options within the same physical package to simplify supply chain management.

Single Zener Diodes Replacement Considerations

Consult official substitution guides for equivalent parts with matching pinouts and electrical parameters. Verify compatibility regarding package dimensions and thermal performance before implementing any alternative components.