SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The CFR0808 is a fan roof plate manufactured by Hoffman Enclosures, Inc., designed for rack thermal management. Constructed from 2 mm zinc-plated mild steel, it measures approximately 760 x 758 mm with a depth of 24 mm. The component supports the mounting of up to six ventilation fans (DFN) or closing plates (DFC) on the top of an enclosure. This configuration allows for incremental cooling adjustments based on the specific number of fans installed.
Verify exact dimensional compatibility with existing rack structures before procurement. Confirm that the mounting interface aligns with the specific enclosure model being upgraded. Ensure the zinc-plated steel material meets environmental corrosion resistance requirements for the intended deployment location. Cross-reference the part number with official manufacturer documentation to confirm current production status and availability.
Select this component when incremental cooling capacity is required within a standard rack footprint. It is suitable for applications where heat load may vary over time, allowing for future expansion by adding more fans. Consider the 2 mm steel thickness for structural integrity during fan installation. Evaluate the need for closing plates if not all six mounting positions will be utilized immediately.
This part belongs to the Hoffman Enclosures fan roof plate series, specifically designed for rack-mounted equipment. It serves as a modular solution for enhancing airflow in electrical and electronic enclosures. The product complements other Hoffman thermal management components, such as individual DFN fans and DFC closing plates, to create customizable ventilation strategies.
No public confirmed substitute part numbers are available in the provided documentation.

PLANO, Texas – March 20, 2026 – Diodes Incorporated (Nasdaq: DIOD), a leading global manufacturer and supplier of high-quality application-specific standard products in the…
Read More
Understand thermal fuse operation, Tf, Th and Tm, electrical ratings and mounting. Check temperature limits and replacement requirements for your design.
Read More
Select a common mode choke using noise frequency, current, insulation and signal integrity. Understand impedance curves, layout and filter limitations.
Read More
Compare Pt100 and Pt1000 RTDs, two-, three- and four-wire connections, excitation and self-heating. Build an error budget from element to reported temperature.
Read More
In the world of embedded electronics, getting a device to “think” is only half the battle. The other half is getting it to communicate…
Read More
Choose an ADC converter by resolution, sample rate, noise and input design. Review practical tradeoffs and prepare component requirements for ChipApex.
Read More
Learn how rectifiers convert AC to DC, compare half-wave and bridge circuits, and select voltage, current, recovery and thermal ratings for your design.
Read More-768x745.jpg)
CHICAGO, USA – May 27, 2026 – Global leading interconnect manufacturer Molex officially issued a global distributor price adjustment notice on May 27, confirming…
Read MoreAs 2025 draws to a close, the global semiconductor industry stands at a crossroads. Intertwined with escalating geopolitical tensions, supply chain disruptions, and groundbreaking…
Read More
Understand how oscillators generate timing signals, how they differ from crystals, and which frequency, output and stability specs matter when choosing one.
Read More
Munich, Germany – May 26, 2026 – Power semiconductor and automotive chip giant Infineon Technologies AG has formally notified customers worldwide of a second…
Read MoreRecently, global semiconductor manufacturers have been constantly making moves in aspects such as technological cooperation, product manufacturing processes, and market layout, demonstrating the rapid…
Read More