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CPC7557N is listed in the Bridge Rectifier range at ChipApex. The manufacturer field lists IXYS Integrated Circuits Division. Its product description is BRIDGE RECT 1P 120V 250MA 8-SOIC. Review the specifications below when checking this part for your BOM.
The CPC7557N is a monolithic integrated diode bridge manufactured by IXYS Integrated Circuits Division using High Voltage Silicon-On-Insulator (SOI) technology. It provides a compact surface-mount solution for rectification and protection applications. The device features an 8-pin SOIC package with four active pins and four no-connection pins. Key electrical ratings include a maximum reverse voltage of 120 V and an average forward current of 250 mA. The junction temperature range extends up to 150°C, ensuring reliable operation in demanding environments.
Verify the specific ordering suffix when purchasing. The CPC7557N designation refers to the standard tube packaging format containing 100 units per tube. Alternative tape and reel options exist for automated assembly processes. Confirm compliance with RoHS directives and lead-free soldering requirements prior to integration into final assemblies.
Select this component for applications requiring high-voltage isolation within a small footprint. The SOI technology offers superior performance compared to traditional planar processes. Ensure thermal management accounts for the specified thermal impedance. Verify that the operating voltage and current limits remain within the recommended operating conditions defined in the datasheet.
This part belongs to the CPC7557 series of integrated diode bridges. It is designed specifically for high-voltage applications where space constraints are critical. The use of SOI technology distinguishes it from conventional discrete bridge rectifiers, offering improved reliability and switching characteristics in a standardized 8-pin SOIC form factor.
Direct pin-to-pin replacements must match the 120 V reverse voltage rating and 250 mA forward current capability. Verify that substitute components utilize compatible SOIC-8 packages and meet the same thermal and ESD specifications. Cross-reference with other IXYS IC division bridge rectifiers if available.
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