SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The CR230226G013 is an industrial-grade instrument enclosure manufactured by Hammond Manufacturing, part of the R230 series. Constructed from Acrylonitrile Butadiene Styrene (ABS) with a light gray finish, it provides IP66 watertight protection and UL 94 V-0 flammability rating. The unit measures 160 mm in length, 130 mm in width, and 60 mm in height, weighing approximately 362.87 grams.
Verify the manufacturer designation carefully, as official documentation lists Hammond Manufacturing rather than Hoffman Enclosures. Confirm that the specific model number aligns with the R230 series specifications provided in the source data before procurement to ensure compatibility with intended installation requirements.
Select this enclosure when IP66 watertight performance and ABS material properties are required for industrial applications. Ensure the internal dimensions accommodate the target components within the 160x130x60 mm footprint. Verify that the light gray color meets aesthetic or identification standards for the deployment environment.
This component belongs to the R230 series of micro enclosures designed for industrial use. It is categorized under instrument enclosures and falls within the broader class of boxes and cases. The product is distinct from DIN rail or wall-mount variants due to its standalone form factor and specific dimensional profile.
Consult Hammond Manufacturing documentation for direct cross-references within the R230 series. Verify dimensional and mounting hole compatibility if substituting with other industrial ABS enclosures. Hoffman Enclosures products may not be direct equivalents due to differing design standards.

Samsung Electronics, the world’s largest memory chip manufacturer, has officially confirmed the end-of-life (EOL) for its LPDDR4 and LPDDR4X low-power DRAM products, marking a…
Read More
TOKYO, April 1, 2026 – Kioxia Corporation (formerly Toshiba Memory Corporation), a global leader in flash memory and storage solutions, has officially issued a…
Read More
PLANO, Texas – March 20, 2026 – Diodes Incorporated (Nasdaq: DIOD), a leading global manufacturer and supplier of high-quality application-specific standard products in the…
Read MoreAs 2025 draws to a close, the global semiconductor industry stands at a crossroads. Intertwined with escalating geopolitical tensions, supply chain disruptions, and groundbreaking…
Read More
Munich, Germany – May 26, 2026 – Power semiconductor and automotive chip giant Infineon Technologies AG has formally notified customers worldwide of a second…
Read More
Select a common mode choke using noise frequency, current, insulation and signal integrity. Understand impedance curves, layout and filter limitations.
Read More
Recently, a survey by the Electronic Components Industry Association (ECIA) revealed that the sales sentiment of global electronic components remained optimistic in the third…
Read More
Select a bridge rectifier by reverse voltage, capacitor charging current, startup surge and cooling. Work through a stated DC voltage and ripple example.
Read More
Hsinchu, Taiwan – April 18, 2026 – United Microelectronics Corporation (UMC, NYSE: UMC), a leading global semiconductor foundry specializing in mature process technologies, has…
Read More
In the world of embedded electronics, getting a device to “think” is only half the battle. The other half is getting it to communicate…
Read More
STMicroelectronics (ST), a global leader in semiconductor manufacturing, has officially notified customers of a new round of price increases for selected products, set to…
Read More
TOKYO — Global leading semiconductor and power electronic components manufacturer Renesas Electronics officially issued a new price adjustment notice in early September 2026, confirming…
Read More