SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The CUVN08502SS is a cooling unit manufactured by Hoffman Enclosures, Inc., designed for industrial electrical enclosures. It provides 850W of cooling capacity and operates on an AC voltage of 230V at 60 Hz. The unit features a stainless steel construction with an IP54 and NEMA 12 ingress protection rating. Its physical width measures 313mm. The device includes integrated temperature control functionality but does not support master/slave operation modes.
Verify the specific manufacturing date code and revision level against the latest nVent Hoffman technical documentation to ensure compatibility with existing panel designs. Confirm that the 230V AC power supply matches the site infrastructure requirements before installation. Check for any updated mounting hardware specifications or accessory kits required for secure integration into the target enclosure frame.
Select this model when high corrosion resistance is required due to the stainless steel build. Ensure the application demands approximately 850W of cooling power within the specified 230V AC operational range. Verify that the 313mm width fits the available space in the target enclosure. Consider that the lack of master/slave capability limits its use in complex multi-unit configurations without additional external controls.
This component belongs to the Hoffman line of thermal management solutions, which are engineered to protect sensitive electronic components from overheating. These units are part of a broader portfolio including ventilation systems and cooling technologies designed for harsh industrial environments. The product series emphasizes durability and reliable performance for mission-critical applications requiring robust environmental sealing.
Publicly confirmed substitute part numbers are not available in the provided source material. Consult official nVent Hoffman catalogs for direct replacements or cross-reference compatible models based on identical cooling capacity (850W), voltage (230V AC), and physical dimensions.

On October 1, 2025 local time, OpenAI, an artificial intelligence research company, announced the establishment of a cooperative relationship with Samsung Electronics and SK…
Read MoreRecently, global semiconductor manufacturers have been constantly taking actions and presenting numerous new developments in aspects such as process technology and product research and…
Read More
Compare Pt100 and Pt1000 RTDs, two-, three- and four-wire connections, excitation and self-heating. Build an error budget from element to reported temperature.
Read More
Monolithic Power Systems (MPS), a global leader in analog and mixed-signal semiconductors, has notified its distribution partners of an upcoming price increase for selected…
Read More
Choose an ADC converter by resolution, sample rate, noise and input design. Review practical tradeoffs and prepare component requirements for ChipApex.
Read MoreThe Dutch government’s intervention in the control of Nexperia (Anshi Semiconductor) is triggering a chain reaction of turmoil in the global power semiconductor market.…
Read More
Understand UART protocol framing, baud rate and electrical interfaces. Learn 8N1 timing, TX/RX wiring, buffering and practical troubleshooting steps.
Read More
Understand RF attenuator dB values, fixed and programmable types, impedance, power limits and noise tradeoffs before choosing parts for an RF signal path.
Read More
TOKYO, April 1, 2026 – Kioxia Corporation (formerly Toshiba Memory Corporation), a global leader in flash memory and storage solutions, has officially issued a…
Read More
See when an inductor behaves linearly, how DC bias and saturation reduce inductance, and which current and temperature curves to check.
Read MoreAs 2025 draws to a close, the global semiconductor industry stands at a crossroads. Intertwined with escalating geopolitical tensions, supply chain disruptions, and groundbreaking…
Read MoreLas Vegas, January 6, 2026 — At the Consumer Electronics Show (CES) 2026, Texas Instruments (TI) (NASDAQ: TXN) announced a suite of next-generation semiconductor…
Read More