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CY37128VP100-83AXC is listed in the Complex Programmable Logic Devices range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is IC CPLD 128MC 15NS 100TQFP. Review the specifications below when checking this part for your BOM.
The CY37128VP100-83AXC is a 5V Ultra37000 CPLD featuring 128 macrocells and 64 I/O pins. It operates within the 83 MHz speed bin, characterized by a propagation delay (tPD) of 6.5 ns and a maximum frequency (fMAX) of 167 MHz. The device utilizes In-System Reprogrammable (ISR) technology via a JTAG interface, allowing design updates without pinout or timing changes. It supports flexible clocking with four synchronous clocks per logic block and includes programmable bus-hold capabilities on all I/Os for noise reduction.
Verify the specific ordering suffix against the manufacturer's selection guide to confirm package type and temperature range. Ensure compatibility with existing 5V supply rails and 3.3V/5V I/O levels as defined by VCCO connections. Confirm that the required development tools support the Ultra37000 family architecture for proper configuration.
Select this model for designs requiring 128 macrocells with an 83 MHz performance target. The VP100 suffix indicates a 100-lead TQFP package. Verify that the application requires 5V core voltage operation. Consider the 6.5 ns tPD when designing critical timing paths, noting that delays are consistent regardless of product term usage or routing complexity.
This component belongs to the Cypress Semiconductor Ultra37000 CPLD family, which was later acquired by Infineon Technologies. The family is distinguished by its Programmable Interconnect Matrix (PIM) architecture, which provides global routing resources and eliminates route-dependent timing penalties. The CY37128 variant offers a balance of density and speed suitable for complex logic implementations.
Direct replacements within the same family include other CY37128 variants with different speed bins or packages. Cross-family migration may require architectural adjustments due to differences in macrocell structure and interconnect topology.
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