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CY62126DV30L-55ZSXE is listed in the Memory IC range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is IC SRAM 1MBIT PARALLEL 44TSOP II. Review the specifications below when checking this part for your BOM.
Memory IC specifications for CY62126DV30L-55ZSXE
- Description：IC SRAM 1MBIT PARALLEL 44TSOP II
- Series：MOBL™
- Mfr：Infineon Technologies
- Package：Tube
- Memory Type：Volatile
- Memory Format：SRAM
- Technology：SRAM - Asynchronous
- Memory Size：1Mbit
- Memory Organization：64K x 16
- Memory Interface：Parallel
- Write Cycle Time - Word, Page：55ns
- Voltage - Supply：2.2V ~ 3.6V
- Operating Temperature：-40°C ~ 125°C (TA)
- Mounting Type：Surface Mount
- Package / Case：44-TSOP (0.400", 10.16mm Width)
- Supplier Device Package：44-TSOP II
- Access Time：55 ns
- Grade：-
- Qualification：-
Memory IC datasheet and documents for CY62126DV30L-55ZSXE
Memory IC Overview
The CY62126DV30L-55ZSXE is a 1-Mbit (64K x 16) asynchronous static RAM manufactured by Infineon Technologies. It operates within a voltage range of 2.2V to 3.6V and features a 55ns access time. The device is housed in a 44-pin TSOP II package and supports an industrial temperature range from -40°C to +85°C, as well as an automotive range up to +125°C. It offers ultra-low active current of 5mA at maximum speed and standby current of 15µA for the automotive grade.
Memory IC Feature Summary
- Ultra-low power consumption with automatic power-down when deselected
- Pin-compatible with legacy CY62126BV devices
- Supports byte-level write operations via BHE and BLE pins
Memory IC Applications
- Portable cellular telephones
- Automotive electronic systems
- Industrial control units requiring low-power memory
Memory IC Procurement Notes
Verify that the specific ordering suffix matches the required package type and lead-free status. Confirm the temperature grade aligns with the target application environment. Ensure compatibility with existing board layouts due to pin-to-pin equivalence with older Cypress models.
Memory IC Selection Notes
Select this component for designs prioritizing extended battery life in portable electronics. Consider the wide operating voltage range for flexible power supply architectures. Evaluate thermal resistance values if high-density packaging or limited airflow conditions are present in the final assembly.
Memory IC Part Context
This part belongs to the MoBL SRAM family designed for low-power applications. It succeeds earlier generations like the CY62126BV while maintaining functional compatibility. The device utilizes advanced CMOS circuit design to minimize energy usage during both active and standby states.
Memory IC Replacement Considerations
Direct pin-compatible replacements include the CY62126BV series. Verify that substitute parts meet the same voltage and temperature specifications to ensure reliable operation without circuit modification.
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