CY7C1327S-133AXI

Memory IC Overview

The CY7C1327S-133AXI is a synchronous static random-access memory (SRAM) integrated circuit manufactured by Infineon Technologies. It provides a total storage capacity of 4.5 Mbit, organized as 512K x 9 bits. The device supports a maximum clock frequency of 133 MHz and features a typical access time of 4 ns. It operates on a single 3.3 V power supply and utilizes a parallel interface for data transfer. The component is housed in a 100-pin Thin Quad Flat Package (TQFP) with dimensions of 14x14 mm, designed for surface-mount technology applications.

Memory IC Feature Summary

• Supports high-speed synchronous data transfer at frequencies up to 133 MHz
• Provides low-latency performance with a 4 ns access time
• Features a compact 100-pin TQFP package suitable for space-constrained designs

Memory IC Applications

• High-performance computing systems requiring fast memory access
• Network infrastructure equipment such as routers and switches
• Industrial automation control units

Memory IC Procurement Notes

Verify the specific suffix 'S' against the manufacturer's current datasheet to confirm pinout and electrical characteristics, as variations exist within the CY7C1327 family. Ensure compatibility with 3.3 V logic levels and check for moisture sensitivity handling requirements during assembly. Confirm availability status directly with authorized distributors, as lead times may vary based on production cycles.

Memory IC Selection Notes

Select this component when a balance of moderate density and high speed is required for synchronous bus architectures. Compare against the CY7C1327G variant if lower power consumption is a priority, noting that the G version typically offers reduced active current while maintaining similar timing specifications. Evaluate board space constraints given the 100-TQFP footprint.

Memory IC Part Context

This part belongs to the CY7C1327 series of synchronous SRAMs from Infineon. The series includes variants like the CY7C1327G and CY7C1327D, which share similar architectural foundations but differ in power profiles and specific timing parameters. These devices are designed for embedded applications needing reliable, fast volatile memory solutions.

Memory IC Replacement Considerations

Publicly confirmed substitute part numbers for this specific model were not identified in the provided documentation. Engineers should consult official cross-reference guides or contact Infineon sales for validated alternatives.