CY7C1361C-133AXC

Memory IC Overview

The CY7C1361C-133AXC is a 9-Mbit synchronous flow-through SRAM with a 256K x 36 organization. It supports 133 MHz bus operations with a maximum access time of 6.5 ns. The device uses a 3.3 V core supply and 2.5 V or 3.3 V I/O supply. It features user-selectable linear or interleaved burst sequences, separate processor and controller address strobes, and synchronous self-timed writes. Available in Pb-free 100-pin TQFP, 165-ball FBGA, and 119-ball BGA packages.

Memory IC Feature Summary

• Supports high-speed 133 MHz bus operations with fast clock-to-output times
• Provides user-selectable linear or interleaved burst sequences via the MODE pin
• Features separate processor (ADSP) and controller (ADSC) address strobes for flexible system integration
• Includes asynchronous output enable and ZZ sleep mode for power management

Memory IC Applications

• Secondary cache memory for Pentium and i486 processors
• High-performance embedded systems requiring low-latency data access
• Cache controllers utilizing interleaved or linear burst access patterns

Memory IC Procurement Notes

Verify package availability as the component is offered in multiple form factors including TQFP, FBGA, and BGA. Confirm voltage requirements match the specific design constraints for both core and I/O supplies. Check for end-of-life status or discontinuation notices from Infineon Technologies prior to finalizing procurement plans.

Memory IC Selection Notes

Select this model for applications requiring a 256K x 36 memory organization with synchronous interface capabilities. Ensure the system design accommodates the 3.3 V core and dual-voltage I/O options. Consider the package type based on board space and thermal requirements, noting that JTAG support varies by package.

Memory IC Part Context

This part belongs to the Cypress/Infineon NoBL family of synchronous SRAMs designed for high-speed microprocessor interfaces. It shares functional similarities with the CY7C1363C but differs in memory organization (256K x 36 vs. 512K x 18). The product line emphasizes minimal glue logic requirements and high performance through flow-through architecture.

Memory IC Replacement Considerations

The CY7C1363C is a related part within the same datasheet but offers a different memory organization (512K x 18). Verify compatibility if substituting, as pinouts and electrical characteristics may differ slightly depending on the specific package variant selected.