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DD104N16KHPSA1 is listed in the Diode Arrays range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is DIODE MOD GP 1600V 104A MOD. Review the specifications below when checking this part for your BOM.
The DD104N16KHPSA1 is a 20 mm press-fit rectifier diode module from the Infineon Power Block series. It features a 1600 V repetitive peak reverse voltage rating and supports an average forward current of 104 A at 180° electrical sine conduction. The device handles a non-repetitive surge current of 2500 A for 10 ms. Key thermal parameters include a junction-to-case thermal resistance of 0.39 K/W and a maximum junction temperature of 150°C. The on-state voltage drop is 0.7 V at maximum junction temperature, with a forward voltage slope resistance of 2.1 mΩ.
Verify the specific suffix HPSA1 against official Infineon documentation to confirm package and terminal configuration. Confirm current production status and availability directly with authorized distributors or Infineon sales representatives prior to ordering. Ensure compatibility with existing cooling structures designed for 20 mm modules.
Select this module for applications requiring 1600 V blocking capability and 104 A continuous current handling in a compact 20 mm footprint. The press-fit interface simplifies assembly compared to traditional screw terminals. Evaluate thermal management requirements based on the specified 0.39 K/W junction-to-case resistance to ensure operation within the 150°C maximum junction temperature limit.
This component belongs to the Infineon Power Block series, specifically the DD104N family of rectifier diodes. These modules are engineered for high reliability in demanding power electronics environments. The product line emphasizes robust construction suitable for industrial-grade performance and longevity in critical power conversion tasks.
Consult official Infineon substitution guides for verified alternatives. Cross-reference technical specifications such as voltage ratings, current capabilities, and package dimensions before considering any substitute components.
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