DD800S45KL3B5NPSA1

$1,128.76

Description：DIODE MOD GP 4500V 800A MOD
Series：-

SKU:bd91f56888e4 Category: Diode Arrays Brand: Infineon Technologies

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Product introduction

DD800S45KL3B5NPSA1 is listed in the Diode Arrays range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is DIODE MOD GP 4500V 800A MOD. Review the specifications below when checking this part for your BOM.

Diode Arrays specifications for DD800S45KL3B5NPSA1

Description：DIODE MOD GP 4500V 800A MOD
Series：-
Mfr：Infineon Technologies
Package：Tray
Diode Configuration：2 Independent
Technology：Standard
Voltage - DC Reverse (Vr) (Max)：4500 V
Current - Average Rectified (Io) (per Diode)：800A (DC)
Voltage - Forward (Vf) (Max) @ If：3.1 V @ 800 A
Speed：-
Reverse Recovery Time (trr)：-
Current - Reverse Leakage @ Vr：-
Operating Temperature - Junction：-50°C ~ 125°C
Mounting Type：Chassis Mount
Package / Case：Module
Supplier Device Package：Module
Grade：-
Qualification：-

Diode Arrays datasheet and documents for DD800S45KL3B5NPSA1

DD800S45KL3B5NPSA1

Diode Arrays Overview

The DD800S45KL3_B5 is a highly insulated IGBT module featuring an AlSiC base plate and enhanced insulation of 10.4 kV AC for 60 seconds. It provides a repetitive peak reverse voltage (VRRM) of 4500 V, a continuous DC forward current (IF) of 800 A, and a repetitive peak forward current (IFRM) of 1600 A. The module includes internal basic insulation using AlN with creepage distances up to 64.0 mm and clearance distances up to 40.0 mm. It operates within a junction temperature range of -50 °C to 125 °C.

Diode Arrays Feature Summary

Highly insulated package design with 10.4 kV AC isolation capability
AlSiC base plate construction for increased thermal cycling robustness
High surge current capability and high dynamic robustness
Extended creepage and clearance distances for medium-voltage applications

Diode Arrays Applications

Motor drives
Multi-level inverters
Traction drives
Wind turbines
Medium-voltage converters

Diode Arrays Procurement Notes

Verify the specific ordering suffix against official Infineon documentation to ensure correct configuration. Confirm that the component meets all relevant industrial qualification standards, including IEC 60747, 60749, and 60068. Ensure mounting torque specifications are strictly followed during installation to maintain electrical integrity and thermal performance.

Diode Arrays Selection Notes

Select this module for applications requiring high voltage isolation and robust thermal management in demanding environments. The AlSiC base plate offers superior thermal cycling capability compared to standard materials. Verify that the system design accommodates the required creepage and clearance distances for the intended operating voltage and pollution degree.

Diode Arrays Part Context

This component belongs to Infineon's portfolio of highly insulated power modules designed for industrial and traction applications. It integrates advanced packaging technologies to support high-power density designs while maintaining strict safety isolation requirements. The module is engineered to withstand harsh operational conditions typical of renewable energy and heavy-duty transportation systems.