SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The DI2208R5 is an inner door manufactured by nVent HOFFMAN, designed for use with floor-standing enclosures measuring 800 mm in width and 2200 mm in height. Constructed from 16 gauge mild steel, this component provides a hinged mounting surface for equipment positioned behind a standard or glazed front door. It features double-bit 3 mm locking mechanisms to secure the internal assembly. The unit offers an available mounting space of 80 mm between the inner door and the front panel, facilitating the installation of control components while maintaining the enclosure's IP65 protection rating.
Verify that the target enclosure matches the specific dimensions of 800 mm width and 2200 mm height to ensure proper fitment. Confirm that the required material specification aligns with 16 gauge mild steel construction. Ensure the locking mechanism requirements are compatible with the specified double-bit 3 mm design before finalizing procurement orders.
Select this part specifically for applications involving large floor-standing enclosures where internal mounting surfaces are required behind the primary access door. Consider the 80 mm spacing constraint when planning component layout. Verify compatibility with existing glazed or standard front doors to maintain the intended aesthetic and protective characteristics of the assembly.
This component belongs to the DI Series of inner doors produced by nVent HOFFMAN. It serves as a specialized accessory for larger industrial enclosure systems, distinct from standard outer doors. The product is engineered to complement floor-standing units, providing necessary internal support structures without compromising the external integrity or ingress protection ratings of the housing.
Public confirmed substitute part numbers are not available in the provided documentation.

TOKYO, April 1, 2026 – Kioxia Corporation (formerly Toshiba Memory Corporation), a global leader in flash memory and storage solutions, has officially issued a…
Read More
Learn how a pressure transducer converts pressure into voltage, current, or digital output, and compare pressure references and key selection specs.
Read More
Learn why PTC resistance rises with temperature, how it differs from NTC, and which ratings matter for sensing and protection.
Read MoreMay 4, 2026 — The global power semiconductor market is grappling with a worsening supply crunch, as lead times for key components have extended…
Read MoreSeptember 16, 2026 – Global — Leading semiconductor manufacturer ON Semiconductor (onsemi, NASDAQ: ON) has officially issued a formal price adjustment letter to global…
Read More
The global memory market is entering an unprecedented supply-constrained phase as soaring demand from artificial intelligence (AI) infrastructure collides with strategic capacity reallocations by…
Read More
[Shenzhen/Shanghai/Beijing, January 2025] — As global digital transformation accelerates, the electronic components industry has reached a critical inflection point in 2025. Emerging fields such…
Read More
Understand UART protocol framing, baud rate and electrical interfaces. Learn 8N1 timing, TX/RX wiring, buffering and practical troubleshooting steps.
Read More
Geneva, Switzerland – March 25, 2026 – STMicroelectronics N.V. (NYSE: STM), a global semiconductor leader serving customers across the electronics applications spectrum, has announced…
Read More
Recently, the global electronic component market has witnessed a series of new developments. The strategic layouts and market collaborations of major enterprises are constantly…
Read More
Choose logic inverter ICs by thresholds, supply, output drive and delay. Compare standard and Schmitt-trigger inputs, power sequencing and replacement checks.
Read More
Learn how rectifiers convert AC to DC, compare half-wave and bridge circuits, and select voltage, current, recovery and thermal ratings for your design.
Read More