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DPX107150DT-6030A2 is listed in the RF Multiplexers range at ChipApex. The manufacturer field lists TDK Corporation. Its product description is MULTILAYER DIPLEXER FOR 2.5GHZ W. Review the specifications below when checking this part for your BOM.
The DPX107150DT-6030A2 is a multilayer diplexer manufactured by TDK Corporation, designed for signal conditioning in wireless local area network (W-LAN) and Bluetooth applications. It operates within a frequency range of 617 MHz to 2.69 GHz with a nominal impedance of 50 Ohms. The component features an insertion loss of 0.38 dB and supports surface mount device (SMD/SMT) board mounting. It functions reliably across a temperature range from -40°C to +90°C.
Verify the specific ordering suffix against official TDK documentation to ensure correct variant selection. Confirm that the requested part matches the exact DPX series designation required for your circuit design. Cross-reference the manufacturer part number with authorized distributor catalogs to validate authenticity and current production status before finalizing procurement orders.
Select this component when designing circuits requiring isolation between 2.4GHz/2.5GHz bands and higher frequency W-LAN ranges. Ensure the 50 Ohm impedance specification aligns with the system's transmission line requirements. Consider the operating temperature limits and physical footprint constraints during the layout phase to maintain signal integrity and thermal performance.
This component belongs to the DPX series of passive signal conditioning devices produced by TDK. These parts are engineered for high-frequency applications where size reduction and performance stability are critical. The series typically utilizes ceramic dielectric materials to achieve precise filtering characteristics suitable for modern mobile and wireless communication standards.
Consult official TDK substitution guides for compatible alternatives. Verify that any substitute part maintains identical frequency ranges, impedance values, and package dimensions to ensure seamless integration without redesigning the printed circuit board or altering the RF matching network.
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