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DS91M047TMA/NOPB is listed in the Drivers, Receivers, Transceivers range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC TRANSCEIVER 4/0 16SOIC. Review the specifications below when checking this part for your BOM.
The DS91M047TMA/NOPB is a quad M-LVDS line driver manufactured by Texas Instruments, designed for high-speed data transmission. It operates with a supply voltage range of 3 V to 3.6 V and accepts LVCMOS or LVTTL input signals. The device supports data rates up to 250 Mb/s and features four drivers and four receivers within a single package. It is housed in a 16-pin SOIC package and functions reliably across an operating temperature range of -40°C to +85°C. The typical propagation delay is 5 ns, with a maximum power dissipation of 2.21 W.
Verify the specific suffix 'TMA' against the official datasheet to confirm the tape-and-reel packaging configuration. Ensure the component meets RoHS requirements as specified in the manufacturer's documentation. Cross-reference the full part number including the '/NOPB' designation to guarantee lead-free status and exact electrical characteristics before finalizing procurement orders.
Select this component when a quad channel M-LVDS transmitter is required to interface with standard CMOS logic levels. It is suitable for applications needing 250 Mb/s throughput over differential pairs. Compare against the DS91C180 if only two channels are needed, or consider the DS90LV047A for higher speed LVDS requirements without M-LVDS compatibility constraints.
This part belongs to the DS91M047 series of M-LVDS interface devices from Texas Instruments. It is functionally related to the DS91M047TMAX variant, differing primarily in packaging type. The series is designed to replace older LVDS solutions where M-LVDS standards offer better noise immunity and drive capabilities for longer traces.
The DS91M047TMAX is a confirmed alternative with identical electrical specifications but utilizes a tube package instead of a reel. Verify pinout compatibility and thermal performance differences between the SOIC-16 tube and reel configurations during board redesign.
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