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EL2630 is listed in the Logic Output Optoisolators range at ChipApex. The manufacturer field lists Everlight Electronics Co Ltd. Its product description is OPTOISO 5KV 2CH OPEN COLL 8-DIP. Review the specifications below when checking this part for your BOM.
The EL2630 is a high-speed logic output optocoupler manufactured by Everlight Electronics Co Ltd. It features an open collector configuration with a single channel and a nominal data rate of 10 MBps. The device provides a maximum insulation voltage of 5000 Vrms and a common-mode transient immunity of 5kV/µs. It is housed in an 8-DIP package designed for through-hole mounting, supporting a forward current of 0.02 A and operating within a temperature range of -40 °C to 100 °C.
Verify the specific suffix or variant against the official Everlight datasheet to ensure compatibility with required isolation voltages and speed ratings. Confirm that the 8-DIP through-hole package aligns with the target PCB layout constraints. Check for RoHS compliance status if environmental regulations apply to the end product assembly process.
Select this component when high-speed digital isolation is required between circuits with significant potential differences. The open collector output suits applications needing level shifting or driving external loads. Ensure the system operates within the specified -40 °C to 100 °C temperature range and respects the 0.02 A forward current limit for reliable long-term performance.
The EL2630 belongs to Everlight's family of high-speed logic output optoisolators. It is designed to replace older discrete isolation components in modern digital circuits. The device integrates an infrared LED and an open collector phototransistor on a single chip, providing compact solutions for noise reduction in sensitive electronic environments.
Consult Everlight's official cross-reference documentation for verified substitute part numbers. Ensure any replacement maintains the 10 MBps data rate and 5000 Vrms isolation rating. Verify pinout compatibility and package dimensions before integrating alternative components into existing designs.
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