EL5130IS

Instrumentation, Op Amps, Buffer Amps Overview

The EL5130IS is a high-speed voltage feedback amplifier featuring a 300MHz -3dB bandwidth and 1.8nV/√Hz input noise voltage. It operates on single supplies from 5V to 12V or dual supplies from ±2.5V to ±6V with a typical supply current of 4mA. The device provides a 350V/µs slew rate, 1500MHz gain-bandwidth product, and 100mA drive performance. It includes a fast disable feature and maintains stability at gains as low as 5.

Instrumentation, Op Amps, Buffer Amps Feature Summary

• Ultra-low noise performance suitable for sensitive signal applications
• High-speed operation with 300MHz bandwidth and rapid slew rates
• Integrated fast disable control pin for power management
• Stable operation across wide gain settings down to unity

Instrumentation, Op Amps, Buffer Amps Applications

• Imaging systems
• Instrumentation circuits
• Communications devices

Instrumentation, Op Amps, Buffer Amps Procurement Notes

Verify the specific ordering suffix against the manufacturer's documentation to confirm package type and tape-and-reel specifications. Ensure the selected variant matches the required RoHS compliance status and lead-free annealing requirements for your assembly process.

Instrumentation, Op Amps, Buffer Amps Selection Notes

Select this component when low voltage noise and high speed are critical constraints. The EL5130IS offers a compact 8-lead SOIC package ideal for space-limited designs requiring robust drive capability and stable performance at lower closed-loop gains.

Instrumentation, Op Amps, Buffer Amps Part Context

This part belongs to the EL5130/EL5131 series of ultra-low voltage noise amplifiers designed for communications and imaging. While originally manufactured by Intersil Americas Inc., the product line is now managed under Renesas Electronics Corporation following corporate acquisitions.

Instrumentation, Op Amps, Buffer Amps Replacement Considerations

The EL5131IW serves as the functional equivalent in a smaller SOT-23 package. Verify pinout compatibility and thermal dissipation characteristics before substituting, as the package dimensions differ significantly.