EP3SL200H780I4LG

Field Programmable Gate Array Overview

The EP3SL200H780I4LG is a Stratix III Field Programmable Gate Array (FPGA) manufactured by Altera. It features 200,000 logic elements and 80,000 Adaptive Logic Modules (ALMs). The device includes 10.4 Mbit of embedded memory and supports 488 I/O pins. It is housed in a 780-ball High-Performance Ball Grid Array (HBGA) package. The component operates within an industrial temperature range of -40°C to +85°C and complies with RoHS standards. Moisture Sensitivity Level (MSL) is rated at 3, corresponding to a 168-hour limit at peak reflow temperatures.

Field Programmable Gate Array Feature Summary

• High-density programmable logic architecture utilizing Adaptive Logic Modules for efficient resource utilization.
• Integrated high-capacity embedded memory subsystem supporting complex data processing requirements.
• Industrial-grade thermal performance ensuring stable operation across extended temperature ranges.

Field Programmable Gate Array Applications

• High-performance digital signal processing systems
• Complex communication protocol implementations
• Industrial automation control units

Field Programmable Gate Array Procurement Notes

Verify the complete part number including the suffix 'I4LG' to ensure correct temperature grade and packaging specifications. Confirm RoHS compliance status and Moisture Sensitivity Level (MSL 3) requirements prior to assembly planning. Check for recent Product Change Notifications regarding labeling or material composition updates from the manufacturer.

Field Programmable Gate Array Selection Notes

Select this model when 200,000 logic elements and 488 available I/Os are required within a 780-pin form factor. Ensure design tools support the Stratix III family architecture. Consider power consumption estimates using official analysis tools during the early design phase to meet thermal constraints.

Field Programmable Gate Array Part Context

This component belongs to the Altera Stratix III FPGA family, designed for mid-to-high-end applications requiring significant logic density. It succeeds earlier generations while offering enhanced memory bandwidth and I/O flexibility compared to lower-tier devices in the same series.

Field Programmable Gate Array Replacement Considerations

Direct pin-compatible replacements within the same package are limited due to specific logic density variations. Verify functional equivalence with other EP3SL200 variants if package compatibility is critical, noting potential differences in speed grades or memory configurations.