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FAN1117AS5X is listed in the Voltage Regulators - Linear, Low Drop Out (LDO) Regulators range at ChipApex. The manufacturer field lists onsemi. Its product description is IC REG LINEAR 5V 1A SOT-223-4. Review the specifications below when checking this part for your BOM.
The FAN1117AS5X is a fixed-output low-dropout linear regulator manufactured by onsemi. It provides a stable 5V output with a maximum continuous current of 1A. The device operates within an input voltage range of 2.5V to 18V and features a maximum dropout voltage of 1.2V at full load. It includes internal current limiting and thermal shutdown protection for robust operation. The component is housed in a SOT-223-4 surface-mount package and supports an operating temperature range from 0°C to +125°C.
Verify component authenticity through authorized distribution channels due to obsolete status. Confirm package marking and date codes against official datasheets. Check for RoHS compliance documentation if required for specific regulatory environments. Ensure storage conditions meet manufacturer specifications to prevent degradation prior to assembly.
Select this component when a fixed 5V output is required with up to 1A load capability. Consider the SOT-223-4 package for space-constrained PCB layouts. Evaluate thermal performance based on expected power dissipation and ambient temperature conditions. Verify that the input voltage range aligns with the system's supply architecture.
This part belongs to the FAN1117 series of low-dropout regulators, designed for general-purpose power management applications. The series offers various fixed output voltages and adjustable versions to accommodate diverse system requirements. Manufactured by onsemi, these components are widely used in consumer electronics and industrial equipment for reliable voltage regulation.
NCP1117ST50T3G is listed as a similar substitute option. Verify pin compatibility and electrical specifications before replacement. Ensure the alternative component meets all original design constraints including package dimensions and thermal characteristics.
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