FF450R08A03P2XKSA1

Power Driver Modules Overview

The FF450R08A03P2XKSA1 is a HybridPACK DSC S2 half-bridge IGBT module utilizing EDT2 technology. It features a 750 V collector-emitter voltage and a 450 A implemented collector current. The continuous DC collector current is 300 A at 120°C case temperature, with a repetitive peak current of 900 A. Total power dissipation reaches 1667 W at 25°C. The module supports an extended operating junction temperature up to 175°C and includes integrated on-die current and temperature sensors for precise state monitoring.

Power Driver Modules Feature Summary

• Integrates on-die current and temperature sensors for enhanced system protection and intelligent control
• Features low inductive design and double-sided cooling for superior thermal performance
• Utilizes EDT2 Micro-Pattern Trench-Field-Stop cell design optimized for electric drive trains

Power Driver Modules Applications

• Hybrid Electric Vehicles (HEV)
• Electric Vehicles (EV)
• Automotive inverters

Power Driver Modules Procurement Notes

Verify the specific ordering code SP001630036 against official Infineon documentation to ensure correct part identification. Confirm that the component meets automotive reliability standards required for your specific application environment. Check for any updated datasheet revisions or material content sheets before finalizing procurement specifications.

Power Driver Modules Selection Notes

Select this module for applications requiring high current density and robust short-circuit ruggedness. The integrated sensors simplify gate driver requirements by providing direct feedback on device state. Ensure the cooling system supports double-sided cooling to maximize thermal efficiency and leverage the 175°C extended operation capability.

Power Driver Modules Part Context

This component belongs to the HybridPACK DSC family, designed specifically for automotive high-power applications. It implements Infineon's EDT2 generation, which offers benchmark current density and optimized light load power losses. The package is engineered for compact designs with high mechanical robustness and insulation capabilities.

Power Driver Modules Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation.