FFA30UP20DNTU

Diode Arrays Overview

The FFA30UP20DNTU is a dual common cathode ultrafast recovery power rectifier in a TO-3PN package. It features a peak repetitive reverse voltage of 200 V and an average rectified forward current of 5 A at a case temperature of 120°C. The device exhibits a maximum reverse recovery time of 45 ns under specific test conditions and supports a non-repetitive peak surge current of 150 A. It includes avalanche energy rating capabilities and utilizes planar construction technology.

Diode Arrays Feature Summary

• Ultrafast soft recovery characteristics for high-speed switching applications
• Avalanche energy rated for robust operation under transient conditions
• Planar construction design ensuring high reliability

Diode Arrays Applications

• Output rectifiers
• Switching mode power supplies
• Free-wheeling diodes for motor applications
• Power switching circuits

Diode Arrays Procurement Notes

Verify the manufacturer origin, as the datasheet indicates Fairchild Semiconductor while the model prefix suggests onsemi lineage. Confirm the package marking matches 'F30UP20DN' to ensure authenticity. Check for RoHS compliance status and verify if the component is available in full production or obsolete status before procurement.

Diode Arrays Selection Notes

Select this component for circuits requiring fast recovery times and high surge current handling. Ensure the thermal management design maintains the case temperature within limits to support the specified average forward current. Verify that the 200 V reverse voltage rating exceeds the circuit's peak operating voltage with adequate margin.

Diode Arrays Part Context

This component belongs to the ultrafast recovery power rectifier family. It is designed for general-purpose high-frequency rectification. The TO-3PN package provides a robust mechanical structure suitable for through-hole mounting. The dual common cathode configuration allows for use in bridge or push-pull topologies.

Diode Arrays Replacement Considerations

Check for direct equivalents from Fairchild Semiconductor or onsemi with identical pinout and electrical ratings. Verify that any substitute maintains the same TO-3PN package dimensions and thermal resistance characteristics to fit existing board layouts.