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FSA66L6X is listed in the Analog Switches, Multiplexers, Demultiplexers range at ChipApex. The manufacturer field lists onsemi. Its product description is IC SWITCH SPST-NOX1 6MICROPAK. Review the specifications below when checking this part for your BOM.
The FSA66L6X is a low-voltage ultra high-speed (UHS) single-pole/single-throw (SPST) normally open analog switch manufactured by onsemi. It operates within a supply voltage range of 1.65V to 5.5V and features rail-to-rail signal handling capabilities. The device provides an on-resistance of up to 7 Ohms at VCC=4.5V with a 30mA input current, ensuring minimal propagation delay through the switch. It exhibits a -3dB bandwidth exceeding 250 MHz and maintains a quiescent supply current of no more than 10 µA across the full operating temperature range of -40°C to +85°C.
Verify the specific ordering suffix against the manufacturer's official documentation to ensure correct packaging and tape specifications. Confirm that the component meets all required RoHS compliance standards before integration into final assemblies. Cross-reference the updated part number nomenclature on the manufacturer website due to system integration changes.
Select this component when designing circuits requiring low on-resistance and high bandwidth for single-channel signal routing. Ensure the control input logic levels are compatible with CMOS standards. Verify that the thermal resistance characteristics of the MicroPak package align with the power dissipation requirements of the target application environment.
This component belongs to the FSA66 series of low-voltage UHS analog switches originally developed by Fairchild Semiconductor. Following corporate integration, the product line was transitioned to onsemi, resulting in updates to ordering information and system nomenclature while maintaining the original electrical specifications and functional performance.
Direct replacements include other single SPST analog switches from the same family, such as the FSA66M5X or FSA66P5X, provided the package footprint matches the design constraints. Verify pinout compatibility and electrical parameters before substitution.
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