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GC20N65FD is listed in the Single FETs, MOSFETs range at ChipApex. The manufacturer field lists Goford Semiconductor. Its product description is MOSFET N-CH 650V 20A 40W TO-220. Review the specifications below when checking this part for your BOM.
The GC20N65FD is an N-channel enhancement mode power MOSFET utilizing super junction technology. It features a drain-source voltage of 650V and a continuous drain current of 20A at 25°C case temperature. The maximum on-resistance is 190mΩ at VGS=10V, with a typical gate charge of 39nC. The device operates within a junction temperature range of -55°C to 150°C and has a single pulse avalanche energy rating of 245mJ. It is housed in a TO-220F package.
Verify the specific suffix 'FD' corresponds to the TO-220F insulated package and optimized body diode variant. Confirm RoHS compliance status matches current manufacturing revisions. Ensure thermal management designs account for the specified junction-to-case resistance values provided in the datasheet.
Select this component for high-voltage applications requiring superior soft-switching performance due to its optimized body diode. The TO-220F package simplifies thermal interface implementation by removing separate insulation requirements. Verify that the 650V rating aligns with system voltage peaks and that the 20A current capacity meets load requirements.
This part belongs to Goford Semiconductor's high-voltage super junction MOSFET lineup. It is designed as a direct replacement for standard TO-220 devices where improved efficiency and reduced thermal stress are required. The FD designation specifically indicates the inclusion of the insulated flange package.
Check pinout compatibility with existing PCB layouts when substituting standard TO-220 parts. Verify that the gate charge specifications match the driving circuit capabilities to prevent switching delays or excessive heat generation in the controller.
The 'FD' suffix indicates that the device utilizes a TO-220F package, which includes an integrated electrical insulation layer on the metal tab, allowing direct mounting to heatsinks without additional insulators.
The device features an ultra-fast body diode with optimized reverse recovery time and charge, which minimizes switching losses and voltage spikes during the commutation phases typical in LLC resonant topologies.
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