GIB2401-E3/81

Diode Arrays Overview

The GIB2401-E3/81 is a fast recovery rectifier manufactured by Vishay. It features a dual common cathode configuration housed in a TO-220-3 package. The device supports a maximum repetitive peak reverse voltage of 50 V and an average forward rectified current of 16 A. Key electrical parameters include a forward voltage of 975 mV at 16 A, a reverse leakage current of 5 µA at 50 V, and a maximum surge current of 125 A. The junction temperature range spans from -65°C to +150°C with a recovery time of 35 ns.

Diode Arrays Feature Summary

• Dual common cathode architecture for efficient power conversion
• Fast recovery characteristics suitable for high-speed switching applications
• Robust thermal performance with extended operating temperature range

Diode Arrays Applications

• High-frequency power supply circuits
• DC-DC converter topologies
• Free-wheeling diode implementations

Diode Arrays Procurement Notes

Verify the specific suffix /81 indicates tape and reel packaging when sourcing. Confirm RoHS compliance status through official manufacturer documentation prior to integration. Ensure the TO-220-3 lead form matches the target PCB footprint requirements for proper mounting.

Diode Arrays Selection Notes

Select this component for designs requiring high current handling with moderate reverse voltage ratings. The dual common cathode structure simplifies circuit layout compared to discrete solutions. Evaluate thermal management needs based on the 16 A continuous current rating and junction temperature limits.

Diode Arrays Part Context

This part belongs to Vishay's general purpose and power diode portfolio. It complements other fast recovery rectifiers in the GIB series. The component serves as a standard solution for medium-power electronic equipment requiring reliable rectification.

Diode Arrays Replacement Considerations

GIB2401-E3/45 is a verified substitute offering identical electrical specifications in a tube package format. Verify pin compatibility and thermal dissipation capabilities when transitioning between packaging types.