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HCPL-5501#100 is listed in the Transistor, Photovoltaic Output Optoisolators range at ChipApex. The manufacturer field lists Broadcom Limited. Its product description is OPTOISO 1.5KV TRANS W/BASE 8-SMD. Review the specifications below when checking this part for your BOM.
The HCPL-5501#100 is a high-reliability, single-channel optocoupler manufactured by Broadcom Limited. It features a hermetically sealed 8-pin ceramic DIP package with gold-plated leads, designed for demanding environments. The device provides an isolation voltage of 1500VDC and supports a bandwidth of 9MHz. Key electrical parameters include a forward current of 20mA, a forward voltage of 1.55V, and an output current of 8mA. Power dissipation is rated at 200mW, with a minimum current transfer ratio of 9% at 16mA input. It operates within a temperature range of -55°C to +125°C and complies with MIL-PRF-38534 Class H standards.
Verify the specific suffix #100 corresponds to the ceramic DIP variant with gold-plated leads. Confirm compliance requirements against MIL-PRF-38534 Class H specifications. Ensure sourcing channels provide traceability documentation for military-grade components. Check lead finish integrity upon receipt. Validate packaging seals to maintain hermetic properties during storage and handling.
Select this component when hermetic sealing and military-grade reliability are mandatory. The ceramic package offers superior thermal stability compared to plastic alternatives. Consider the 9MHz speed for applications requiring fast switching without compromising isolation integrity. Evaluate the 1500VDC rating against system voltage requirements. Ensure the 8-pin form factor fits the designated footprint constraints.
This part belongs to Broadcom's high-reliability optocoupler family designed for critical applications. It utilizes a phototransistor output configuration within a robust ceramic housing. The series is engineered to meet stringent military standards, distinguishing it from commercial-grade isolators. The hermetic seal protects internal components from moisture and contaminants, extending operational lifespan in extreme conditions.
Direct replacements must match the 8-pin ceramic DIP package and hermetic sealing requirement. Verify equivalent isolation voltage and bandwidth specifications. Ensure compatibility with MIL-PRF-38534 Class H standards if military qualification is required. Pinout alignment and thermal characteristics must be identical to maintain circuit board integrity.
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