HDAF-23-18.0-S-13-2-P

HDAF-23-18.0-S-13-2-P is listed in the Arrays, Edge Type, Mezzanine (Board To Board) range at ChipApex. The manufacturer field lists Samtec Inc.. Its product description is 2.00 MM X 1.20 MM HD MEZZ RUGGED. Review the specifications below when checking this part for your BOM.

Arrays, Edge Type, Mezzanine (Board To Board) specifications for HDAF-23-18.0-S-13-2-P

• Description：2.00 MM X 1.20 MM HD MEZZ RUGGED
• Series：HD Mezz™ HDAF
• Mfr：Samtec Inc.
• Package：Tray,Tray
• Connector Type：High Density Array, Female
• Number of Positions：299
• Pitch：0.047" (1.20mm)
• Number of Rows：13
• Mounting Type：Surface Mount
• Features：Board Guide, Pick and Place
• Contact Finish：Gold
• Contact Finish Thickness：30.0µin (0.76µm)
• Mated Stacking Heights：30mm, 35mm
• Height Above Board：0.807" (20.51mm)

Arrays, Edge Type, Mezzanine (Board To Board) datasheet and documents for HDAF-23-18.0-S-13-2-P

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