HFA120MD40C

Diode Arrays Overview

The HFA120MD40C is a HEXFRED ultrafast, soft recovery diode module from Vishay General Semiconductor - Diodes Division. It features a dual common cathode configuration housed in an isolated TO-244AB package. The device supports a maximum repetitive reverse voltage of 400 V and a continuous forward current of 111 A at 25°C case temperature. Key electrical characteristics include a typical reverse recovery time of 36 ns, a peak reverse recovery current of 9.3 A, and a reverse recovery charge of 420 nC. The junction-to-case thermal resistance is 0.70 °C/W for single-leg conduction.

Diode Arrays Feature Summary

• Optimized for high-frequency power conditioning systems to reduce switching losses and electromagnetic interference.
• Soft recovery characteristic eliminates the need for snubber circuits in most applications.
• Extensive characterization of recovery parameters across varying current, temperature, and di/dt conditions simplifies loss calculations.

Diode Arrays Applications

• Power converters
• Motor drives
• High frequency DC/DC converters

Diode Arrays Procurement Notes

Verify component authenticity through authorized distributors or direct manufacturer channels. Confirm RoHS3 compliance status and check for specific manufacturing date codes relevant to your production timeline. Ensure mounting surfaces are smooth, flat, and free of burrs before installation. Apply thermal grease evenly and adhere strictly to specified torque limits during assembly to maintain thermal performance and mechanical integrity.

Diode Arrays Selection Notes

Select this module when low EMI and reduced snubbing requirements are critical in high-frequency designs. The soft recovery profile minimizes voltage spikes and ringing associated with hard-switching applications. Evaluate thermal management needs based on the provided junction-to-case resistance values. Consider the operating temperature range and derating curves for continuous forward current when designing the heat sink interface.

Diode Arrays Part Context

This component belongs to the HEXFRED series, which utilizes specialized silicon technology to achieve ultrafast recovery times. The TO-244AB isolated package allows for efficient mounting to heatsinks while providing electrical isolation between the terminals and the mounting surface. This design facilitates reliable operation in demanding industrial and commercial power electronics environments.

Diode Arrays Replacement Considerations

No public confirmed substitute part numbers are available in the source documentation.

Diode Arrays FAQ

What is the typical reverse recovery time (trr) for the HFA120MD40C?

The typical reverse recovery time is 36 ns under test conditions of IF = 1.0A, dif/dt = 200A/µs, and VR = 30V.

How does the soft recovery feature benefit circuit design?

The soft recovery characteristic eliminates the need for a snubber in most applications by reducing voltage overshoot and ringing caused by rapid changes in current during turn-off.

What is the maximum junction temperature for operation?

The maximum operating junction temperature is +150°C.