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HMC797-SX is listed in the RF Amplifiers range at ChipApex. The manufacturer field lists Analog Devices Inc.. Its product description is IC RF AMP GPS 0HZ-22GHZ DIE. Review the specifications below when checking this part for your BOM.
The HMC797-SX is a monolithic microwave integrated circuit (MMIC) power amplifier manufactured by Analog Devices Inc. utilizing GaAs technology. It operates across a frequency range of 0 Hz to 22 GHz, making it suitable for wideband applications. The device provides a typical gain of 14.5 dB with a noise figure of approximately 3.5 dB. Key performance metrics include a saturated output power (Psat) of 28.5 dBm and a P1dB compression point of 28.5 dBm. It requires a single positive supply voltage of 10 V and draws a bias current of 400 mA. The component is supplied in a die package format.
Verify the specific suffix 'SX' indicates the bare die configuration when sourcing components. Confirm that the application design accounts for the required 10V supply and thermal management associated with the die-level packaging. Ensure compatibility with the active bias controller specifications provided in the official datasheet to maintain optimal linearity and power output during integration.
Select this component for designs requiring broad bandwidth coverage extending down to DC frequencies. Consider the GaAs technology benefits for high-frequency efficiency compared to silicon alternatives. Evaluate the need for external matching networks to interface with standard 50-ohm systems given the die-level form factor and specific impedance requirements outlined in the manufacturer's documentation.
This part belongs to the HMC797 series of RF amplifiers designed for high-performance wireless infrastructure. It complements other variants such as the HMC797APM5E which offers similar electrical characteristics but in a surface-mount LFCSP package. The SX suffix specifically denotes the unencapsulated die version intended for custom substrate integration or advanced packaging solutions within Analog Devices' portfolio.
The HMC797A-SX serves as a direct functional equivalent within the same series, offering identical electrical specifications in a die format. For applications requiring a pre-packaged solution, the HMC797APM5E provides comparable performance in an LFCSP-32 package. Verify pinout and thermal pad configurations when transitioning between these specific package styles.
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