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HS1KL is listed in the Single Diodes range at ChipApex. The manufacturer field lists Taiwan Semiconductor Corporation. Its product description is DIODE STANDARD 800V 1A SUB SMA. Review the specifications below when checking this part for your BOM.
The HS1KL is a surface mount high-efficiency ultra-fast glass passivated rectifier manufactured by Taiwan Semiconductor Corporation. It features an 800 V reverse voltage rating and a 1 A average forward current capability. The device utilizes a Sub SMA (SOD-323FL) package for compact PCB integration. Key electrical characteristics include a maximum reverse leakage current of 5 µA at rated voltage and a typical junction capacitance of 4 pF. The component is designed for high-speed switching applications with a maximum recovery time of 75 ns.
Verify the specific suffix code to confirm exact packaging configuration, as variations exist between tape-and-reel and cut-tape formats. Confirm RoHS compliance status and halogen-free designation against the latest manufacturer datasheet revision. Ensure the ordering part number matches the required voltage and current ratings for the target application circuit.
Select this component when high-speed recovery is critical to minimize switching losses in power conversion stages. The 800 V rating provides sufficient margin for standard industrial AC line voltages. Consider the thermal performance of the Sub SMA package for high-current continuous operation scenarios.
This device belongs to the HS1K series of high-efficiency rectifiers from Taiwan Semiconductor. The series offers various voltage ratings including 200V, 400V, and 600V options within the same physical package family. The HS1KL specifically addresses the 800V requirement for higher voltage DC bus applications.
Direct pin-compatible substitutes may include other manufacturers' 1A 800V ultra-fast rectifiers in SOD-323FL packages. Verify that replacement parts meet or exceed the 75 ns reverse recovery time specification. Check for identical forward voltage drop characteristics to ensure similar thermal behavior.
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