IS43DR16160B-25DBL-TR

$2.73

Description：IC DRAM 256MBIT PAR 84TWBGA
Series：-
Mfr：ISSI, Integrated Silicon Solution Inc
Package：Tape & Reel (TR)

SKU:e486008ff471 Category: Memory IC Brand: ISSI, Integrated Silicon Solution Inc

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Product introduction

IS43DR16160B-25DBL-TR is listed in the Memory IC range at ChipApex. The manufacturer field lists ISSI, Integrated Silicon Solution Inc. Its product description is IC DRAM 256MBIT PAR 84TWBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for IS43DR16160B-25DBL-TR

Description：IC DRAM 256MBIT PAR 84TWBGA
Series：-
Mfr：ISSI, Integrated Silicon Solution Inc
Package：Tape & Reel (TR)
Memory Type：Volatile
Memory Format：DRAM
Technology：SDRAM - DDR2
Memory Size：256Mbit
Memory Organization：16M x 16
Memory Interface：Parallel
Clock Frequency：400 MHz
Write Cycle Time - Word, Page：15ns
Voltage - Supply：1.7V ~ 1.9V
Operating Temperature：0°C ~ 70°C (TA)
Mounting Type：Surface Mount
Package / Case：84-TFBGA
Supplier Device Package：84-TWBGA (8x12.5)
Access Time：400 ps
Grade：-
Qualification：-

Memory IC datasheet and documents for IS43DR16160B-25DBL-TR

IS43DR16160B-25DBL-TR

Memory IC Overview

The IS43DR16160B-25DBL-TR is a 256 Mbit Low Power DDR2 SDRAM manufactured by ISSI. It features a 16-bit data bus width and supports maximum clock frequencies up to 400 MHz. The device operates within a voltage range of 1.7 V to 1.9 V and utilizes an 84-ball BGA package with dimensions of 8 mm x 12.5 mm. It is designed for industrial temperature ranges, functioning between -40°C and +85°C.

Memory IC Feature Summary

Supports high-speed parallel data transfer via DDR2 interface
Optimized for low power consumption in mobile applications
Industrial grade reliability across extended temperature ranges

Memory IC Applications

Mobile phones and smartphones
Portable media players
Wireless communication devices

Memory IC Procurement Notes

Verify the specific suffix 'BL' versus 'BLI' against the manufacturer's current datasheet, as these often denote distinct packaging or material compliance variations. Confirm the exact pinout compatibility with the target PCB footprint before procurement. Ensure the supplier provides valid RoHS documentation matching the component revision.

Memory IC Selection Notes

Select this component when a 256 Mbit density with a 16-bit interface is required for space-constrained designs. The 84-ball BGA form factor offers a compact solution compared to larger packages. Consider the 400 MHz speed grade if higher bandwidth is necessary for the application's processing demands.

Memory IC Part Context

This part belongs to the IS43DR series of LPDDR2 SDRAMs from ISSI. These components are engineered for battery-powered portable electronics where power efficiency and small footprint are critical. The series typically includes variants with different speed grades and package options to suit diverse design requirements.