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ISL9011AIRFJZ-T is listed in the Voltage Regulators - Linear, Low Drop Out (LDO) Regulators range at ChipApex. The manufacturer field lists Renesas Electronics Corporation. Its product description is IC REG LINEAR 2.5V/2.8V 10DFN. Review the specifications below when checking this part for your BOM.
The ISL9011AIRFJZ-T is a dual low-dropout (LDO) linear voltage regulator manufactured by Renesas Electronics Corporation. It features two independent fixed output channels providing 2.5 V and 2.8 V, respectively. The device supports a maximum output current of 150 mA per channel with an input voltage range of 2.3 V to 6.5 V. Key electrical specifications include a typical dropout voltage of 250 mV at 150 mA, a line regulation of 0.2%, and a load regulation of 1%. The unit operates within a temperature range of -40°C to +85°C and utilizes a 10-lead DFN 3x3 mm package.
Verify the specific suffix configuration against official datasheets to confirm output voltages and package type. Confirm availability status as distribution channels may list obsolete or discontinued variants. Ensure compatibility with surface-mount assembly processes given the small form factor. Check for moisture sensitivity level requirements during storage and handling procedures.
Select this component when dual isolated LDO outputs are required in a compact footprint. Compare dropout characteristics against system headroom constraints. Evaluate noise specifications relative to sensitive analog circuitry needs. Consider the operating temperature range suitability for the intended deployment environment.
This part belongs to the ISL9011A series of dual LDO regulators designed for low-noise applications. The family typically includes various output voltage combinations and packaging options. Renesas acquired Intersil, which originally developed this product line, ensuring continued support through updated documentation and manufacturing standards.
Consult official substitution guides for compatible dual LDOs with matching pinouts and electrical parameters. Verify that alternative components meet the same noise and PSRR requirements. Ensure thermal performance and package dimensions are compatible with existing board layouts.
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