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ISP827XG is listed in the Transistor, Photovoltaic Output Optoisolators range at ChipApex. The manufacturer field lists Isocom Components 2004 LTD. Its product description is OPTOISOLATOR 5KV 2CH TRANS 8-DIP. Review the specifications below when checking this part for your BOM.
The ISP827XG is a high-density, dual-channel phototransistor optocoupler manufactured by Isocom Components. It features a plastic DIP-8 package and provides 5300 Vrms isolation voltage between input and output circuits. The device utilizes NPN phototransistors for signal transmission with a nominal current transfer ratio of 200%. It supports a maximum forward current of 50 mA and operates within a temperature range of -55°C to 100°C. Key electrical specifications include a minimum collector-emitter breakdown voltage of 35 V and a maximum dark power of 100 nA. The component is designed for robust digital isolation applications requiring high density and reliable performance.
Verify the specific lead form (STD or G) required for your PCB layout, as the XG suffix indicates a specific pin configuration distinct from standard variants. Confirm that the DIP-8 package dimensions match your assembly requirements. Ensure the operating temperature range aligns with your environmental conditions. Check for RoHS compliance status if restricted substances are a concern in your manufacturing process.
Select this component when dual-channel isolation is necessary within a single package footprint. The 5300 Vrms rating suits applications demanding high dielectric strength. Consider the 200% CTR for driving logic inputs directly. Compare against single-channel alternatives if only one channel is needed to optimize board space. Verify the breakdown voltage meets the load requirements of the isolated side.
The ISP827XG belongs to the ISP817/ISP827/ISP847 series of high-density mounting phototransistor optically coupled isolators. This series is designed to replace common commercial optocouplers while offering enhanced parameter selection. Isocom Components positions these devices as direct replacements for obsolete parts, providing flexible lead forms to accommodate various manufacturing standards and customer-specific circuit design requirements.
Public confirmed substitute part numbers: None listed.
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