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IW610CHN/A1ZDIMP is listed in the RF Transceiver ICS range at ChipApex. The manufacturer field lists NXP USA Inc.. Its product description is IC. Review the specifications below when checking this part for your BOM.
The IW610CHN/A1ZDIMP is a multiprotocol module from NXP Semiconductors featuring a highly integrated SoC. It supports Wi-Fi 6 (802.11ax), Bluetooth Low Energy (BLE) 5.4, and IEEE 802.15.4 protocols. The device operates on dual bands at 2.4 GHz and 5 GHz with a 1x1 configuration. Key electrical parameters include a maximum output power of 23 dBm and receiver sensitivity ranging from -67.4 dBm to -105.7 dBm. It utilizes SDIO, SPI, UART, and USB interfaces. Operating voltage ranges from 3.14 V to 3.46 V, with a functional temperature range of -40°C to +125°C.
Verify the specific suffix A1ZDIMP against official NXP documentation to confirm exact packaging and tape-and-reel specifications. Ensure compatibility with the target host processor's supported interfaces, such as SDIO or USB. Confirm that the operating environment falls within the specified -40°C to +125°C temperature range. Check for moisture sensitivity levels and required reflow profiles during assembly. Validate that the 3.14 V to 3.46 V supply voltage aligns with the system design.
Select this module when a compact solution supporting Wi-Fi 6, BLE 5.4, and 802.15.4 is required. It is suitable for applications needing dual-band 2.4/5 GHz connectivity with a 1x1 antenna configuration. Consider this part for designs utilizing Linux or RTOS environments. Evaluate the available interfaces (SDIO, SPI, UART, USB) against the host controller capabilities. Ensure the thermal and voltage requirements match the system constraints.
The IW610 series represents NXP's tri-radio architecture combining Wi-Fi, Bluetooth, and 802.15.4. This family targets IoT and industrial markets with optimized power and cost efficiency. The IW610CHN variant specifically integrates these protocols into a single chip, enabling advanced multi-radio capabilities. It serves as a core component for modern wireless modules in the NXP ecosystem.
Public confirmed substitute part numbers are not provided in the source material. Consult NXP official documentation for direct replacements or obsolescence notices.
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