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JANTXV1N5711UBCA is listed in the Diode Arrays range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is DIODE ARRAY SCHOTTKY 50V 33MA UB. Review the specifications below when checking this part for your BOM.
The JANTXV1N5711UBCA is a small-signal Schottky barrier diode manufactured by Microchip Technology. It features a silicon construction housed in the UB surface-mount package, which corresponds to the DO-213AA form factor. The device is qualified under MIL-PRF-19500/444 for high-reliability applications. Key electrical parameters include a maximum DC reverse voltage of 70 V and an average rectified current of 33 mA. The component operates within a junction temperature range of -65°C to 150°C.
Verify that the specific suffix 'UBCA' aligns with the required military qualification level and packaging configuration. Confirm RoHS status, as military variants may differ from commercial designs. Ensure the supplier provides valid traceability documentation for the JAN class component. Validate that the ordering information matches the exact datasheet revision to avoid functional discrepancies in critical systems.
Select this component when a surface-mount solution is required for military-grade Schottky applications. It serves as a direct replacement for the axial 1N5711 in space-constrained PCB layouts. Consider the 70 V reverse voltage rating and 33 mA current limit during circuit design. The UB package offers mechanical robustness suitable for vibration-prone environments compared to standard plastic packages.
This part belongs to the 1N5711 series of Schottky barrier diodes produced by Microchip Technology. The series includes various qualification levels such as JAN, JANTX, and JANTXV. The JANTXV designation indicates a higher reliability tier than standard JAN parts. The UB package represents the surface-mount variant of the traditional DO-35 axial leaded diode.
Direct substitutes include other JANTXV1N5711 variants with compatible packaging. Verify pinout compatibility if replacing with different manufacturers. Ensure thermal management requirements are met as the surface-mount package has different dissipation characteristics than axial leads.
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